LED packaging substrate and LED packaging equipment using same

Abstract

The LED packaging substrate comprises an LED bottom plate, a packaging frame, a metal cooling fin, an LED wafer and fluorescent powder, the metal cooling fin is arranged at the bottom of the LED bottom plate, first grooves are formed in the LED bottom plate at equal intervals, second grooves are formed in the metal cooling fin at equal intervals, the packaging frame is assembled at the top of the LED bottom plate, and the LED wafer is arranged in the packaging frame. According to the LED packaging structure, the second groove and the first groove which are formed in the LED bottom plate and the metal radiator are used in cooperation, the filling effect of heat dissipation silicone grease can be improved, the heat dissipation effect of the LED packaging structure is improved, the heat dissipation efficiency is improved, and the service life of the LED packaging structure is prolonged. And the fluorescent powder arranged in the silica gel layer is matched with the light holes for use, so that the influence of silica gel aging on the light emitting rate can be reduced, and the light transmittance of equipment can be kept.

Description

technical field [0001] The invention relates to LED packaging, in particular to an LED packaging substrate and LED packaging equipment using the LED packaging substrate, and belongs to the technical field of LED packaging. Background technique [0002] LED packaging technology is mostly developed and evolved on the basis of discrete device packaging technology, but it has great particularity. Under normal circumstances, the die of discrete devices is sealed in the package body, and the function of the package is mainly to protect the tube. Core and complete the electrical interconnection, while LED packaging is to complete the output electrical signal and protect the normal operation of the die. Generally speaking, the function of the package is to provide sufficient protection for the chip to prevent the chip from failing due to long-term exposure in the air or mechanical damage. In order to improve the stability of the chip, for the LED package, it also needs to have good ...

AI Technical Summary

Problems solved by technology

[0002] LED packaging technology is mostly developed and evolved on the basis of discrete device packaging technology, but it has great particularity. Under normal circumstances, the die of discrete devices is sealed in the package body, and the function of the package is mainly to protect the tube. Core and complete the electrical interconnection, while LED packaging is to complete the output electrical signal and protect the normal operation of the die. Generally speaking, the function of the package is to provide sufficient protection for the chip to prevent the chip from failing due to long-term exposure in the air or mechanical damage. In order to improve the stability of the chip, for the LED package, it also needs to have good light extraction efficiency and good heat dissipation. A good package can make the LED have better luminous efficiency and heat dissipation environment, thereby improving the life of the LED. High-power LED packaging Due to the complex structure and process, which directly affect the performance and life of the LED, especially the packaging of high-power white LEDs is a hot spot among research hotspots. If the internal input cannot be quickly dissipated, the junction temperature will be too high, which will lead to A series of problems such as reduced light intensity, spectral shift, increased color temperature, increased thermal stress, and accelerated aging of the chip will greatly reduce the service life of the LED, and will also cause accelerated aging of the packaging gel filled on the chip, affecting its transparency. At the same time, the bottom plate and metal heat sink of the existing LED package are all planar structures. This structure not only leads to a small contact area, but also cannot fully contact with the heat dissipation silicone grease, resulting in poor heat dissipation effect and Phenomena of poor stability

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