Thermal modules and electronic equipment

Abstract

Embodiments of the present application provide a heat dissipation module, which includes a two-phase heat dissipation component. The two-phase heat dissipation component includes a sealed metal shell and a liquid working medium located inside the metal shell; a non-metal heat dissipation component, a non-metal heat dissipation component and a two-phase heat dissipation component. The metal shell is welded and connected. A welding layer is formed between the non-metal heat sink and the two-phase heat sink. The surface connecting the non-metal heat sink and the two-phase heat sink is provided with a metal layer. The metal layer is located between the non-metal heat sink and the welding layer. Between them, the metal layer is a titanium-containing metal layer. This heat dissipation module uses two-phase heat dissipation parts and non-metal heat dissipation parts together, and by setting a titanium-containing metal layer on the surface of the non-metal heat dissipation parts, it achieves a reliable welding connection with the two-phase heat dissipation parts. The heat dissipation module has a stable structure and can Achieving better heat dissipation and uniformity effect can also meet the needs of weight reduction, thinning and cost reduction of the heat dissipation module to a certain extent. An embodiment of the present application also provides an electronic device including the heat dissipation module.

Description

Technical field [0001] Embodiments of the present application relate to the field of heat dissipation technology, and in particular, to a heat dissipation module and an electronic device including the heat dissipation module. Background technique [0002] With the development of miniaturization, high integration, and multi-function of electronic equipment, the problem of hot-spot failure in electronic equipment has become a key challenge in the field of consumer electronics. In order to quickly heat the hot spots of high-power chips, the traditional method is to use heat pipes (HP, HP), vapor chambers (VC, also called flat heat pipes) or loop heat pipes (LHP, Loop Heat Pipe) and other two-phase heat dissipation parts for heat dissipation and heat dissipation. However, although these two-phase heat sinks have excellent thermal conductivity, they have shortcomings such as high thickness, large volume, heavy weight, and high cost. Therefore, they cannot better meet the needs o...

AI Technical Summary

Problems solved by technology

However, although these two-phase heat sinks have excellent thermal conductivity, they have disadvantages such as high thickness, large volume, heavy weight, and high cost, so they cannot better meet the needs of folding mobile phones, tablet computers, wearable devices (glasses, watches, VR), etc. Requirements for weight reduction and cost reduction of electronic equipment

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