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Ultra-thin resin cutting knife for cutting small-size MIS packaging material and preparation method of ultra-thin resin cutting knife

A packaging material, small size technology, used in abrasives, grinding devices, manufacturing tools, etc.

Pending Publication Date: 2022-04-29
苏州赛尔科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention discloses a resin ultra-thin cutting knife for cutting small-sized MIS packaging materials and a preparation method thereof, which is used for cutting small-sized packaging materials without problems such as missing corners, R feet, and burrs out of tolerance.

Method used

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  • Ultra-thin resin cutting knife for cutting small-size MIS packaging material and preparation method of ultra-thin resin cutting knife
  • Ultra-thin resin cutting knife for cutting small-size MIS packaging material and preparation method of ultra-thin resin cutting knife
  • Ultra-thin resin cutting knife for cutting small-size MIS packaging material and preparation method of ultra-thin resin cutting knife

Examples

Experimental program
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Embodiment 1

[0024] Formula: 25 parts of diamond, 50 parts of powdered phenolic resin, 10 parts of nano-titanium carbide, 12 parts of nano-tungsten carbide, and 3 parts of fluorite; figure 1 .

Embodiment 2

[0026] Formula: 25 parts of diamond, 52 parts of powdered phenolic resin, 10 parts of nano-titanium carbide, 10 parts of nano-tungsten carbide, and 3 parts of fluorite; figure 2 .

[0027] Formula: 25 parts of diamond, 48 parts of powdered phenolic resin, 12 parts of nano-titanium carbide, 12 parts of nano-tungsten carbide, and 3 parts of fluorite; image 3 .

[0028] Formula: 25 parts of diamond, 55 parts of powdered phenolic resin, 8 parts of nano-titanium carbide, 10 parts of nano-tungsten carbide, and 2 parts of fluorite; Figure 4 .

[0029] The cutting burrs of existing commercially available cutting knives with better performance for MIS packaging materials are too large, and the cutting results are shown in Figure 5 .

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Abstract

The invention discloses a resin ultrathin cutting knife for cutting a small-size MIS packaging material and a preparation method, powdery phenolic resin, nano titanium carbide, nano tungsten carbide and fluorite are mixed, diamond is added, mixing is performed to obtain a material, then the material is loaded into a mold, hot pressing is performed, and the resin ultrathin cutting knife for cutting the small-size MIS packaging material is obtained. The cutting device is used for cutting small-size packaging materials, and the problems of unfilled corners, R pins, out-of-tolerance burrs and the like are solved.

Description

technical field [0001] The invention relates to a resin cutting knife, in particular to a resin ultra-thin cutting knife for cutting small-sized MIS packaging materials and a preparation method thereof. Background technique [0002] The invention relates to the technical field of abrasive tool manufacturing, and relates to a resin bond ultra-thin cutting blade and its preparation process. At present, the resin ultra-thin cutting blade is mainly composed of abrasive grains, fillers, and resin powder, and the abrasive grains mainly include diamond and cBN. , the resin powder is mainly phenolic resin, epoxy resin, new phenolic resin, etc., and the filler can improve the strength, hardness and electrical conductivity of the blade. [0003] Resin ultra-thin cutting blades are widely used in the processing of hard and brittle materials due to their good cutting performance and fast cutting speed. With the rapid development of the semiconductor industry, glass wafers are widely use...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D5/12B24D3/28B24D3/32B24D3/34B24D18/00C08L61/06C08K3/04C08K3/14C08K3/16
CPCB24D5/12B24D3/285B24D3/32B24D3/342B24D18/0009C08K3/04C08K3/14C08K3/16C08K2201/011C08K2201/014C08K2003/162C08L61/06
Inventor 李威冉隆光毛金锐李斌黎梅贾楠
Owner 苏州赛尔科技有限公司