Structure and heat dissipation method of thin film capacitor
A technology of film capacitors and film capacitors, applied in the direction of film/thick film capacitors, capacitors, laminated capacitors, etc., can solve the problems of performance and reliability degradation, and achieve the effects of improving reliability, reducing operating temperature, and optimizing energy consumption
Pending Publication Date: 2022-04-29
BEIJING NEW ENERGY VEHICLE TECH INNOVATION CENT CO LTD
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Problems solved by technology
[0004] In order to solve the problem that the performance and reliability of film capacitors in the prior art are reduced due to the influence of operating temperature, the present invention provides a structure and heat dissipation method of film capacitors
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[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0037] combine Figure 1-2 As shown, the present invention discloses a structure of a film capacitor 5, including a film capacitor 5, the film capacitor 5 is provided with a film capacitor 5 core 4, a film capacitor 5 heat management module 1, a temperature sensor 2 and a semiconductor refrigerator sheet 3, the core body 4 of the film capacitor 5...
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The invention relates to the field of film capacitors, and discloses a film capacitor structure and a heat dissipation method, the film capacitor structure comprises a film capacitor, a film capacitor core body, a film capacitor heat management module, a temperature sensor and a semiconductor chilling plate are arranged in the film capacitor, the film capacitor core body is connected with the temperature sensor, and the semiconductor chilling plate is connected with the film capacitor heat management module. The temperature sensor is connected with the thin-film capacitor heat management module, the thin-film capacitor heat management module is connected with the semiconductor chilling plate, and the semiconductor chilling plate is connected with the thin-film capacitor core body. According to the thin film capacitor structure and the heat dissipation method provided by the invention, components such as the thin film capacitor heat management module, the semiconductor chilling plate and the temperature sensor are arranged in the thin film capacitor, so that the heat dissipation power of the semiconductor chilling plate is adjusted to reduce the working temperature of the thin film capacitor, and the energy consumption of the semiconductor chilling plate is optimized; the reliability of the thin-film capacitor is improved.
Description
technical field [0001] The invention relates to the field of film capacitors, in particular to a structure and heat dissipation method of a film capacitor. Background technique [0002] In recent years, new energy vehicles have developed rapidly in the automotive industry. Due to their characteristics of non-polarity, self-healing ability, high reliability and good frequency characteristics, film capacitors have gradually replaced the original electrolytic capacitors and become the mainstream choice for motor controller support capacitors. [0003] When the motor controller is working, its power devices and film capacitors will generate a certain amount of heat, resulting in a significant temperature rise inside the motor controller, especially with the development of third-generation semiconductor power devices such as Sic in motor controllers in recent years. Gradually applied, since SiC controllers usually have higher power density and limited heat dissipation conditions,...
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IPC IPC(8): H01G4/33H01G4/40H01G4/002H01G2/08
CPCH01G4/33H01G4/40H01G4/002H01G2/08
Inventor 华旸修贵东刘朝辉沈金亮杨上东杨良会原诚寅
Owner BEIJING NEW ENERGY VEHICLE TECH INNOVATION CENT CO LTD