Soft passivation layer in semiconductor fabrication

Abstract

The use of an etch stop layer to define a terminal via opening to access a device feature after formation of a photosensitive soft-passivation layer. The etch stop layer allows the size of the terminal via opening to be decoupled from the resolution capabilities of current photosensitive soft-passivation layer.

Description

technical field [0001] The present invention generally relates to semiconductor manufacturing techniques and soft passivation layers. In particular, it relates to a method of manufacturing integrated circuits. Background technique [0002] In the manufacturing process of semiconductor devices, it is often necessary to form an insulating layer, a semiconductor layer and a conductive layer on a substrate. These layers are patterned to form some features and spaces. The minimum size or feature size (F) of these features and spaces depends on the materials used and the resolution of the lithographic system. These patterns and spaces are patterned to form devices such as transistors, capacitors, and resistors. These devices are then connected to produce the desired electrical function, producing an integrated circuit (IC) or chip. [0003] Fuses are used to change the interconnection of the IC after standard processing is done. The ability to change the interconnections with...

AI Technical Summary

Problems solved by technology

However, existing photosensitive polyimides cannot accommodate the design of advanced fuses with a smaller footprint

Images