Packaging device, packaging module and electronic equipment
A technology for packaging devices and packaging bodies, which is applied to semiconductor devices, electric solid-state devices, semiconductor/solid-state device components, etc., can solve problems such as limited heat dissipation capacity, failure of internal components, internal heat discharge, etc., and achieves a simple preparation process, Improves heat dissipation efficiency and facilitates mass production
Pending Publication Date: 2022-05-06
HUAWEI DIGITAL POWER TECH CO LTD
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Problems solved by technology
[0003] However, most of the existing power semiconductor devices realize heat dissipation through encapsulation glue and casing, the heat dissipation capacity is limited, and the internal heat cannot be discharged in time, which may cause the temperature of the power semiconductor device to be too high, affect the working efficiency and life of the power semiconductor device, and seriously may lead to failure or burning of internal components
Method used
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[0078] Such as figure 1 Shown is a packaging module 1000'. The package module 1000' includes a package device 100' and a heat sink 1100', and the package device 100' is connected to the heat sink 1100' through a heat conduction layer 1200'. Wherein, the packaging device 100' may be a power semiconductor device for power processing, including frequency conversion, voltage conversion, current conversion, power management, etc.
[0079] Such as figure 2 As shown, the packaged device 100' includes a housing 1', a circuit board 2' located in the housing 1', an electronic component 3' located in the housing 1' and electrically connected to the circuit board 2', and a packaged circuit board 2 'and the package body 4' of the electronic components 3', wherein the housing 1' includes a first part 11' and a second part 12' opposite to the first part 11'. Wherein, the circuit board 2' and the electronic components 3' are the main heat sources, the first part 11' can conduct heat and i...
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The invention provides a packaging device, which comprises a circuit board, an electronic component, a packaging body, a shell and at least one first heat dissipation part, and is characterized in that the electronic component is electrically connected with the circuit board; the packaging body is used for packaging the circuit board and the electronic component, and the packaging body can conduct heat; the shell is used for accommodating the circuit board, the electronic component and the packaging body, and at least one surface of the shell is provided with a heat-conducting first part; each first heat dissipation component is connected to the first part and is embedded in the packaging body. The invention further provides a packaging module applying the packaging device and electronic equipment applying the packaging device or the packaging module. According to the invention, the first heat dissipation component is added in the packaging device and cooperates with the first part, so that the heat dissipation efficiency of the packaging device can be effectively improved, and the light, thin, short and small packaging module and high-density packaging are facilitated.
Description
technical field [0001] The present application relates to a packaging device with good heat dissipation effect, a packaging module using the packaging device, and electronic equipment using the packaging device or the packaging module. Background technique [0002] In order to adapt to higher and higher power requirements, power semiconductor devices, especially power semiconductor devices, are evolving towards miniaturization and high density. With the reduction in volume of power semiconductor devices and the increase in the density of internal components, the heat dissipation problem will have a great impact on the improvement of the working efficiency of power semiconductor devices. [0003] However, most of the existing power semiconductor devices realize heat dissipation through encapsulation glue and casing, the heat dissipation capacity is limited, and the internal heat cannot be discharged in time, which may cause the temperature of the power semiconductor device to...
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IPC IPC(8): H01L23/367H01L23/427
CPCH01L23/367H01L23/427
Inventor 张晓杰武昊
Owner HUAWEI DIGITAL POWER TECH CO LTD