Semiconductor packaging structure

Abstract

A semiconductor package structure is provided. The semiconductor package structure includes: a semiconductor package; a substrate; a solder ball disposed between the semiconductor package and the substrate; and a semiconductor thermoelectric element including at least one pair of thermocouples, and the pair of thermocouples including one P-type semiconductor and one N-type semiconductor, in which the semiconductor thermoelectric element is disposed between the semiconductor package and the substrate and is applied with a voltage through the substrate.

Description

technical field [0001] The present disclosure relates to a semiconductor package structure having a semiconductor thermoelectric element, and in particular, to a semiconductor package structure using the semiconductor thermoelectric element to dissipate heat. Background technique [0002] In the prior art, with the integration density of chips and the urgent needs of users, the latest trend in the electronics industry is to develop in the direction of miniaturization, light weight and multi-function. However, these demands lead to a gradual increase in the power consumption of electronic devices, so that heat generated from the semiconductor chip increases during the operation of the semiconductor package containing the semiconductor chip, and the semiconductor chip is actually difficult to dissipate heat after being packaged, so that it is easy to cause severe fever. [0003] At present, heat dissipation blocks or heat dissipation channels are often used to transfer heat g...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present disclosure is to provide a semiconductor package structure that can significantly improve the heat dissipation of the chip package located therein, thereby solving the defect that the semiconductor package structure is difficult to dissipate heat, resulting in poor performance stability of electronic devices

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