Multi-chip integrated circuit package

Abstract

The invention relates to the technical field of integrated circuit packaging, in particular to a multi-chip integrated circuit packaging which comprises a packaging frame, inductors are evenly and fixedly installed on the lower portion of the front end of the packaging frame, a chip set is fixedly installed on the lower portion of the inner wall of the front end of the packaging frame, and wires are fixedly installed at the upper end and the lower end of the chip set. By arranging the water cooling mechanism and the adjusting mechanism, the chipset can be cooled with water, heat generated during operation of the chipset can be absorbed with water, water in the water tank and water in the water tank can be exchanged, the water in the water tank and the water in the water tank can be recycled, and the water in the water tank and the water in the water tank can be recycled. According to the water cooling device, water absorbing heat can enter the water tank, cold water in the water tank enters the water tank, the water cooling effect on the chipset is further improved through water circulation, the service life of the device can be prolonged, and the evaporation speed of water in the water tank can be reduced under the cooperation of the blocking mechanism.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to a multi chip integrated circuit packaging. Background technology [0002] Integrated circuits or semiconductor chips are packaged in protective insulating packaging materials. The packaging materials should provide a good balance between physical properties, chemical properties and cost. For conventional semiconductor chips, the packaging is manufactured through the mold process requiring hydraulic press. [0003] When integrated circuit packaging is used for basketball counting, the integrated circuit packaging can count the balls thrown into the basket. In areas with high temperature, because the basket is outdoors, the external temperature has a certain impact on the integrated circuit packaging. Moreover, under layers of packaging, the heat dissipation effect of the integrated circuit packaging is relatively poor during operation. When it is used for a long ti...

AI Technical Summary

Problems solved by technology

[0003] When the integrated circuit package is used to count basketballs, the integrated circuit package can count the balls thrown into the basket. In areas with relatively high temperature, because the basket is outside, the external temperature has a certain impact on the integrated circuit package. Wrapped in layers, the heat dissipation effect of the integrated circuit package is relatively poor during operation. In long-term use, the heat generated during the operation of the integrated circuit package cannot be dissipated well, making the chip inside the integrated circuit package prone to damage, thus It will reduce the service life of the chip and also increase the cost of using the device

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