Composite board structure and manufacturing method thereof

A composite sheet and manufacturing method technology, applied in the direction of copying/marking method, telephone structure, manufacturing auxiliary device, etc., can solve the problems of low dyne value, inability to apply mobile phone back cover products, and poor bonding force of printing glue, etc., to achieve Meet the performance requirements, meet the appearance requirements, and ensure the effect of adhesion

Pending Publication Date: 2022-05-13
深圳市锦瑞新材料股份有限公司
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Problems solved by technology

[0002] In the prior art, for the composite sheet for making the back cover of the mobile phone, please refer to the layered structure figure 1 As shown, it mainly includes a PC layer 10, a PMMA layer 11, and a printing layer 12 arranged from bottom to top. In this type of structur

Method used

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  • Composite board structure and manufacturing method thereof
  • Composite board structure and manufacturing method thereof
  • Composite board structure and manufacturing method thereof

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[0017] The present invention is described in more detail below in conjunction with the accompanying drawings and embodiments.

[0018] The present invention discloses a composite plate structure, see Figure 2 , which comprises a PC layer 1, the top of the PC layer 1 is provided with a PMMA layer 2, the top of the PMMA layer 2 is coated with a base coating 3, the top of the bottom coating 3 is printed to form a print layer 4.

[0019] The above structure is first coated with a primer on the acrylic layer of the composite board during the manufacturing process, and then printed. Compared with the prior art, the present invention first increases the application of primer glue on the acrylic surface as a carrier, and then prints on the bottom coating, effectively ensuring the adhesion of the printing layer, which can meet the appearance needs of the back cover of the mobile phone and better meet the performance requirements of the product.

[0020] In the present embodiment, the ...

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Abstract

The invention discloses a composite board structure and a manufacturing method thereof. The composite board structure comprises a PC layer, the top of the PC layer is provided with a PMMA layer, the top of the PMMA layer is coated with a priming coat, and the top of the priming coat is printed to form a printing layer. In the manufacturing process, the acrylic layer of the composite board is coated with the priming coat in a curtain coating mode, and then printing is carried out. Compared with the prior art, the method has the advantages that the shower-coating prime coat glue is added on the acrylic surface to serve as a carrier and then is printed on the prime coat, so that the adhesive force to a printing layer is effectively ensured, the appearance requirement of the mobile phone rear cover can be met, and the performance requirement of a product can be well met.

Description

technical field [0001] The invention relates to a composite plate, in particular to a composite plate structure applied to the back cover of a mobile phone and a manufacturing method of the composite plate. Background technique [0002] In the prior art, for the composite sheet for making the back cover of the mobile phone, please refer to the layered structure figure 1 As shown, it mainly includes a PC layer 10, a PMMA layer 11, and a printing layer 12 arranged from bottom to top. In this type of structure, the surface of the composite board is an acrylic layer (PMMA layer), and the material is characterized by low dyne value and printing glue Poor binding force, it can only be used in exhibition facilities and other occasions, and cannot be used in mobile phone back cover products. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a composite plate structure and its manufacturing method that can significantly im...

Claims

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Application Information

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IPC IPC(8): B32B27/30B32B27/36B32B27/08B32B33/00H04M1/02B41M5/52C09J4/06B29C64/30B33Y40/00
CPCB32B27/308B32B27/365B32B27/08B32B33/00H04M1/0202H04M1/02B41M5/5209B41M5/5254C09J4/06B29C64/30B33Y40/00B32B2255/10B32B2255/26B32B2457/00
Inventor 金烈葛秀彬杨璐
Owner 深圳市锦瑞新材料股份有限公司
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