Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Composite board structure and manufacturing method thereof

A composite sheet and manufacturing method technology, applied in the direction of copying/marking method, telephone structure, manufacturing auxiliary device, etc., can solve the problems of low dyne value, inability to apply mobile phone back cover products, and poor bonding force of printing glue, etc., to achieve Meet the performance requirements, meet the appearance requirements, and ensure the effect of adhesion

Pending Publication Date: 2022-05-13
深圳市锦瑞新材料股份有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the prior art, for the composite sheet for making the back cover of the mobile phone, please refer to the layered structure figure 1 As shown, it mainly includes a PC layer 10, a PMMA layer 11, and a printing layer 12 arranged from bottom to top. In this type of structure, the surface of the composite board is an acrylic layer (PMMA layer), and the material is characterized by low dyne value and printing glue Poor binding force, it can only be used in exhibition facilities and other occasions, and cannot be used in mobile phone back cover products

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Composite board structure and manufacturing method thereof
  • Composite board structure and manufacturing method thereof
  • Composite board structure and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] The present invention will be described in more detail below in conjunction with the accompanying drawings and embodiments.

[0018] The invention discloses a composite plate structure, please refer to figure 2 , which includes a PC layer 1, the top of the PC layer 1 is provided with a PMMA layer 2, the top of the PMMA layer 2 is coated with a primer layer 3, and the top of the primer layer 3 is printed with a print layer 4 .

[0019] During the manufacturing process of the above structure, the acrylic layer of the composite board is first coated with a primer layer, and then printed. Compared with the prior art, the present invention first adds the primer glue on the acrylic surface as a carrier, and then prints on the primer layer, which effectively ensures the adhesion to the printing layer, and can meet the needs of the back cover of the mobile phone. The appearance requirements also better meet the performance requirements of the product.

[0020] In this embod...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a composite board structure and a manufacturing method thereof. The composite board structure comprises a PC layer, the top of the PC layer is provided with a PMMA layer, the top of the PMMA layer is coated with a priming coat, and the top of the priming coat is printed to form a printing layer. In the manufacturing process, the acrylic layer of the composite board is coated with the priming coat in a curtain coating mode, and then printing is carried out. Compared with the prior art, the method has the advantages that the shower-coating prime coat glue is added on the acrylic surface to serve as a carrier and then is printed on the prime coat, so that the adhesive force to a printing layer is effectively ensured, the appearance requirement of the mobile phone rear cover can be met, and the performance requirement of a product can be well met.

Description

technical field [0001] The invention relates to a composite plate, in particular to a composite plate structure applied to the back cover of a mobile phone and a manufacturing method of the composite plate. Background technique [0002] In the prior art, for the composite sheet for making the back cover of the mobile phone, please refer to the layered structure figure 1 As shown, it mainly includes a PC layer 10, a PMMA layer 11, and a printing layer 12 arranged from bottom to top. In this type of structure, the surface of the composite board is an acrylic layer (PMMA layer), and the material is characterized by low dyne value and printing glue Poor binding force, it can only be used in exhibition facilities and other occasions, and cannot be used in mobile phone back cover products. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a composite plate structure and its manufacturing method that can significantly im...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B32B27/30B32B27/36B32B27/08B32B33/00H04M1/02B41M5/52C09J4/06B29C64/30B33Y40/00
CPCB32B27/308B32B27/365B32B27/08B32B33/00H04M1/0202H04M1/02B41M5/5209B41M5/5254C09J4/06B29C64/30B33Y40/00B32B2255/10B32B2255/26B32B2457/00
Inventor 金烈葛秀彬杨璐
Owner 深圳市锦瑞新材料股份有限公司
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com