Preparation method of transmission electron microscope sample

Abstract

The invention discloses a preparation method of a transmission electron microscope sample. The method comprises the following steps: fixing the sample to a carrying net of a sample table; rotating the sample table along a rotating shaft, wherein the extending direction of the rotating shaft is parallel to the normal direction of the to-be-thinned surface of the sample; in the rotating process of the sample table, the sample is cut in the cutting direction, and the cutting direction is parallel to the plane where the surface to be thinned is located. According to the technical scheme, in the sample cutting process, the cutting direction is always parallel to the plane where the to-be-thinned surface is located, by changing the rotating angle of the sample table, the cutting light beam can directly cut part of the area behind the component difficult to cut at a certain angle, drawing marks are reduced, and the cutting efficiency is improved. The cutting thickness of the surface to be thinned is more uniform, the thickness of the prepared transmission electron microscope sample is more uniform, and the success rate of sample preparation is improved; and the thickness of the prepared transmission electron microscope sample is relatively uniform, so that convenience can be provided for subsequent observation and analysis.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing and analysis, in particular to a method for preparing a transmission electron microscope sample. Background technique [0002] At present, with the rapid development of semiconductor technology, the demand for chip research and development and failure analysis is increasing day by day. For small process chips or chips with small failure points, the sample is usually cut to thin the sample to a smaller thickness, that is, the sample A tiny structure that can be observed with a transmission electron microscope (Transmission Electron Microscope, TEM) is made, so as to analyze the point of failure of the sample. [0003] In the existing cutting method, due to the different components on the surface of the sample to be prepared, the cutting speed for different components is inconsistent, and the cutting effect is also different. If the more difficult to cut components come first, the easier t...

AI Technical Summary

Problems solved by technology

[0003] In the existing cutting method, due to the different components on the surface of the sample to be prepared, the cutting speed for different components is inconsistent, and the cutting effect is also different. If the more difficult to cut components come first, the easier to cut components will follow. It is easy to produce pull marks, that is, to produce curtain effect

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