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Electroplating layer for terminal and terminal thereof

A technology of electroplating and plating, applied in contact parts and other directions, can solve the problems affecting the service life of smart devices, the terminal corrosion of the interface, and the high cost, and achieve outstanding electrolytic resistance, wear resistance and corrosion resistance. , the effect of prolonging the service life

Pending Publication Date: 2022-05-13
江门市富扬表面处理科技有限公司
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the continuous popularization of smart devices, their frequency of use is getting higher and higher; in the prior art, when smart devices such as mobile It is plugged and unplugged with the data line, and it is often touched by hands. After a long time of use, it is easy to cause corrosion or wear of the terminal of the interface, which will affect the service life of the smart device
[0003] At present, there are various electroplated terminals on the market, but almost all of them use rhodium ruthenium as the corrosion-resistant layer and palladium-nickel as the wear-resistant layer. The cost is expensive, and the anti-corrosion and wear-resistant performance is conducive to further improvement

Method used

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  • Electroplating layer for terminal and terminal thereof

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Embodiment Construction

[0017] The present invention will be further described below in conjunction with specific examples, but the protection scope of the present invention is not limited thereto.

[0018] Such as figure 1 As shown, an electroplating layer for a terminal 8 includes a copper plating layer 7 electroplated on the surface of the terminal 8, and the surface of the copper plating layer 7 is sequentially electroplated with an inner nickel plating layer 6, an inner gold plating layer 5, an inner platinum plating layer 4, and an outer nickel-tungsten plating layer. Coating 3, Outer Gold Coating 2 and Outer Platinum Coating 1. Since the terminal 8 is made of copper material to provide the signal transmission performance and electrical conductivity of the terminal 8; a layer of copper plating layer 7 is electroplated on the surface of the terminal 8, which can be closely combined with the terminal 8, and at the same time a relatively flat electroplating layer is formed on the surface of the te...

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Abstract

The electroplated layer comprises a copper plating layer arranged on the surface of the terminal, and an inner nickel plating layer, an inner transition plating layer, an inner platinum plating layer, an outer nickel-tungsten plating layer, an outer transition plating layer and an outer platinum plating layer are sequentially arranged on the surface of the copper plating layer. The wear resistance, corrosion resistance, hardness and electric contact performance of the terminal can be effectively improved by arranging the nickel-tungsten plating layer and the double platinum layers, the electrolytic resistance is particularly outstanding, the terminal can replace an existing rhodium-ruthenium plating layer for use, and the cost is greatly reduced.

Description

technical field [0001] The invention relates to an electroplating layer for a terminal and a terminal thereof, which are mainly used for an electronic interface and belong to the technical field of electronic equipment. Background technique [0002] With the continuous popularization of smart devices, their frequency of use is getting higher and higher; in the prior art, when smart devices such as mobile It is plugged and unplugged with the data line, and it is often touched by hands. After a long time of use, it is easy to cause corrosion or wear of the terminal of the interface, which will affect the service life of the smart device. [0003] At present, there are various electroplated terminals on the market, but almost all of them use rhodium ruthenium as the corrosion-resistant layer and palladium-nickel as the wear-resistant layer. The cost is expensive, and the anti-corrosion and wear-resistant performance is conducive to further improvement. [0004] Therefore, the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R13/03
CPCH01R13/03
Inventor 肖小兰
Owner 江门市富扬表面处理科技有限公司
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