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Flexible printed circuit board, COF module including same, and electronic device

A technology of flexible printed circuits and circuit patterns, which is applied to printed circuits, printed circuits, printed circuit components, etc., can solve problems such as cracks and reliability degradation of COF modules, and achieve the effect of simplifying the manufacturing process

Active Publication Date: 2022-05-13
LG INNOTEK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Meanwhile, there is a problem that the reliability of the COF module deteriorates due to a crack occurring in one area of ​​the routing pattern due to tensile stress generated in the process of bonding the routing pattern with the chip.

Method used

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  • Flexible printed circuit board, COF module including same, and electronic device
  • Flexible printed circuit board, COF module including same, and electronic device
  • Flexible printed circuit board, COF module including same, and electronic device

Examples

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Embodiment Construction

[0033] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. However, the spirit and scope of the present disclosure are not limited to a part of the described embodiments, but may be implemented in various other forms, and within the spirit and scope of the present disclosure, one or more of the embodiments may be selectively combined and replaced. multiple elements.

[0034] In addition, unless otherwise clearly defined and described, the terms (including technical terms and scientific terms) used in the embodiments of the present disclosure may be interpreted as having the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs, and the terms ( Terms such as those defined in commonly used dictionaries) may be interpreted to have meanings consistent with their meanings in the context of the prior art.

[0035] In addition, the terms used in the embo...

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PUM

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Abstract

A flexible printed circuit board includes: a substrate; a circuit pattern disposed on the substrate; the substrate comprises a chip mounting area, and the circuit pattern comprises a wiring part and a bonding pad part and comprises a first circuit pattern and a second circuit pattern, comprising a first-first pad portion in the chip mounting area, a first-second pad portion outside the chip mounting area, and a first wiring portion connecting the first-first pad portion and the first-second pad portion and extending in a first direction based on the chip mounting area; a second circuit pattern including a second-first pad portion inside the chip mounting area, a second-second pad portion outside the chip mounting area, and a second wiring portion connecting the second-first pad portion and the second-second pad portion, and extending in a second direction; and a third circuit pattern including a plurality of third pad portions in the chip mounting area, including a third wiring portion connecting the third pad portions with an extension wiring portion extending outside the third pad portions, the protective layer being disposed on the first and second wiring portions.

Description

[0001] Cross References to Related Applications [0002] This application claims priority under 35 U.S.C. 119 and 35 U.S.C. 365 from Korean Patent Application No. 10-2020-0140186 (filed October 27, 2020), the entire contents of which are incorporated herein by reference. technical field [0003] Embodiments relate to a flexible printed circuit board, a COF module including the flexible printed circuit board, and electronic equipment. In detail, the flexible printed circuit board may be a flexible printed circuit board for COF. Background technique [0004] Recently, various electronic products have become thinner, miniaturized, and lightweight. Therefore, research into mounting semiconductor chips at high density in a narrow area of ​​electronic equipment is being conducted in various ways. [0005] Among them, since the chip-on-film (COF) method uses a flexible substrate, the COF method can be applied to flat panel displays and flexible displays. That is, COF methods are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/18
CPCH05K1/028H05K1/0203H05K1/18H05K1/118H05K1/189H05K2201/10128H05K1/0281H05K1/111H05K3/28H05K1/147H01L23/4985H05K2201/10136
Inventor 李彦宗金东燦朴起台
Owner LG INNOTEK CO LTD