Electronic product shell manufacturing process
A technology for electronic products and manufacturing processes, applied in coatings and other directions, can solve the problems of glass stiffness and strength decline, and achieve the effects of improving the combination gap problem, less electronic signal interference, and low price.
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specific Embodiment approach 1
[0035] The manufacturing process of the electronic product casing, the present embodiment takes the manufacture of the back cover of the mobile phone as an example, including the following steps:
[0036] Step 1: Prepare the explosion-proof membrane, including:
[0037] (A) Process the basic explosion-proof film with OCA optical adhesive to obtain the required explosion-proof film, including:
[0038] (A1) UV drawing transfer printing on the basic explosion-proof film with OCA optical adhesive;
[0039] (A2) The non-OCA surface of the explosion-proof film obtained in A1 is placed on a UV wire drawing die covered with UV liquid, and the roller is pressed evenly, and the texture on the UV die is transferred to the explosion-proof film;
[0040] (A3) the anti-explosion film obtained in A2 is subjected to UV light irradiation and cured to form a stable texture;
[0041] (B) electroplating the explosion-proof film after UV transfer printing in A to form a coating layer;
[0042]...
specific Embodiment approach 2
[0061] The main difference between the second embodiment and the first embodiment is:
[0062] (1) Specifically, in E, the melting temperature of the transparent plastic material used in the compression injection molding process is 160 ℃-280 ℃, the injection pressure of injection molding is 30MPa-200MPa, and the injection pressure of injection molding is 15MPa-150MPa , the injection time is 0.5s-8s. In this embodiment, the melting temperature is 280° C., the injection pressure for injection filling is 200 MPa, the injection pressure for injection filling is 150 MPa, and the injection time is 8 s.
[0063] (2) Specifically, in E, according to the actual effect requirements in the compression injection molding process, in the mold clamping process, the mold temperature of the fixed mold used is 0°C-180°C, the mold temperature of the movable mold is 0°C-150°C, and the pressure is maintained. The molding pressure is 10MPa-120MPa, and the pressure-holding molding time is 2s-35s. ...
specific Embodiment approach 3
[0068] The main differences between the third embodiment and the second embodiment are:
[0069] (1) Specifically, in E, the melting temperature of the transparent plastic material used in the compression injection molding process is 160 ℃-280 ℃, the injection pressure of injection molding is 30MPa-200MPa, and the injection pressure of injection molding is 15MPa-150MPa , the injection time is 0.5s-8s. In this embodiment, the melting temperature is 200° C., the injection pressure for injection filling is 100 MPa, the injection pressure for injection filling is 90 MPa, and the injection time is 8 s.
[0070] (2) Specifically, in E, according to the actual effect requirements in the compression injection molding process, in the mold clamping process, the mold temperature of the fixed mold used is 0°C-180°C, the mold temperature of the movable mold is 0°C-150°C, and the pressure is maintained. The molding pressure is 10MPa-120MPa, and the pressure-holding molding time is 2s-35s. ...
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Abstract
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