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Heater assembly and joining head including same

A heater and assembly technology, applied in lighting and heating equipment, heating elements, electric heating devices, etc., can solve the problems of heater thermal deformation, damage, and inability to uniformly cool the entire area of ​​the heater, so as to prevent thermal deformation and damage Effect

Pending Publication Date: 2022-06-03
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the case of the conventional heater assembly, the lengths of the plurality of cooling channels, that is, the distances between the plurality of air inlets and the plurality of air outlets are different, so the air discharged from the plurality of air outlets is different. Different pressure and flow
Thus, there is a problem that the entire area of ​​the heater cannot be cooled uniformly
[0008] In this way, if the entire area of ​​the heater cannot be cooled uniformly, temperature deviations will occur in multiple areas of the heater
Also, due to temperature deviation, the heater may be thermally deformed and damaged, and the life of the heater may be shortened

Method used

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  • Heater assembly and joining head including same
  • Heater assembly and joining head including same
  • Heater assembly and joining head including same

Examples

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Embodiment Construction

[0054] Hereinafter, a bonding head and a heater assembly provided in the bonding head according to an embodiment of the present invention will be described with reference to the accompanying drawings.

[0055] like figure 1 As shown, the bond head according to the first embodiment of the present invention is configured to pick up dies 80 from a wafer 90 including dies 80 singulated by a dicing process. Bond headers are used to mount die onto substrates such as printed circuit boards, lead frames, etc.

[0056] The bonding head includes a fixing block 10 , a heat insulating block 20 , a heater assembly 30 and a clip body 40 .

[0057] The fixing block 10 may be connected with a driving unit (not shown). The drive unit functions to move the bonding head horizontally and vertically.

[0058] The heat insulating block 20 prevents the heat generated in the heater assembly 30 from being conducted to the fixing block 10 .

[0059] The chuck body 40 may be configured to use negative...

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PUM

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Abstract

The invention provides a heater assembly and a joint head provided with the same. The heater assembly may include: a housing, an internal accommodation space, and a cooling gas inflow port communicating with the housing; a heater coupled to the housing; and a porous block disposed in the accommodation space.

Description

technical field [0001] The present invention relates to a bonding head for mounting a die on a substrate, and a heater assembly provided on the bonding head. Background technique [0002] In general, in a die bonding process of mounting dies singulated by a sawing process on a substrate such as a printed circuit board, a lead frame, etc., a method of picking up and mounting dies on a wafer onto a substrate is used. Splice head. [0003] The bonding head includes a collet for picking up die by vacuum pressure and a main body for mounting the collet. [0004] In order to mount the die on the substrate, the die needs to be heated. For this purpose, the bonding head includes a heater assembly including a heater. [0005] In addition, the heater assembly includes a cooling module configured to cool the heater. The cooling module is configured to blow air toward the heater to cool the heater. The cooling module includes: a plurality of air inlets into which air flows; a plura...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H05K7/20
CPCH01L21/67144H05K7/20009H01L21/67109H01L21/6838H05B3/06H05B1/0233H01L21/67721H05K13/0409F28D21/0015
Inventor 金顺铉金丙根李炳赞
Owner SEMES CO LTD
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