Micro-spray phase change liquid cooling vapor chamber for server, heat dissipation operation system and control method
A technology of micro-spray and soaking plate, which is applied in the modification of liquid cooling, modification of cooling/ventilation/heating, modification by conduction heat transfer, etc. The backlog of coolant and other problems can solve the problem of local hot spots, the cooling effect is good, and the volume is reduced.
Active Publication Date: 2022-06-07
SOUTH CHINA UNIV OF TECH
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Problems solved by technology
In the environment of high heat flux density, the combination of micro-jet single-phase liquid cooling and vapor chamber can often obtain superior heat dissipation performance, but this method still has the following shortcomings: On the one hand, the coolant in the injection chamber is under uneven pressure, resulting in Uneven injection produces hot spots; on the other hand, the coolant is easy to accumulate in the injection chamber, resulting in dead ends in the circulation
Method used
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Embodiment
[0043] like figure 1 As shown in the figure, a heat dissipation operation system for a micro-spray phase-change liquid-cooled soaking plate for servers includes a micro-spray phase-change liquid-cooled soaking plate 1, a gas flow loop 2 and a liquid cooling circulation loop 3; the micro-spray phase change liquid-cooled soaking plate 1; The liquid-cooled vaporizing plate 1 is installed on the upper part of the server heating chip, and the contact surface is evenly coated with thermally conductive silicone grease, including the micro-spray liquid cooling module 11, the vaporizing plate body 12, the air inlet pipe 13, the liquid inlet pipe 14 and the fluid outlet pipe 15 ; The air inlet pipe 13, the liquid inlet pipe 14 and the fluid outlet pipe 15 can be arranged on the same side or different sides of the micro-spray phase change liquid cooling soaking plate 1 as required, and can be arranged in parallel or vertically.
[0044] like figure 2 and image 3 As shown, the micro-s...
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The invention discloses a micro-spray phase change liquid cooling vapor chamber for a server, a heat dissipation operation system and a control method. The micro-spray phase change liquid cooling vapor chamber comprises a micro-spray liquid cooling module and a vapor chamber body, the micro-spraying liquid cooling module comprises an upper cover plate, a spraying plate and a condensing plate which are stacked in sequence, as well as a liquid inlet pipeline arranged on the spraying plate, and an air inlet pipeline and a fluid outlet pipeline which are arranged on the upper cover plate; the vapor chamber body comprises a condensation plate, a liquid absorption core, an evaporation plate and a liquid injection pipeline; the array spray holes are adopted, on the premise that the spray efficiency is guaranteed, the spray height is reduced, and the size of the micro spray cooling module is reduced, so that the heat dissipation requirement of a CPU or other high-heat-flux chips in a narrow space of a server is met.
Description
technical field [0001] The invention relates to the technical field of heat dissipation of server chips, in particular to a micro-spray phase-change liquid-cooled soaking plate for servers, a heat dissipation operation system and a control method. Background technique [0002] In recent years, the number and scale of data centers around the world have grown rapidly, and high-density server equipment in computer rooms has continued to increase. Its built-in CPU chips or other heat-generating chips are growing exponentially in the direction of miniaturization, high frequency, and high power density, and the heat generation is sharp. Increase. [0003] Liquid-cooled heat dissipation has gradually become the mainstream heat dissipation method for server micro-chips with high heat flux density, but direct liquid-cooled heat dissipation is prone to leakage of cooling capacity, resulting in the risk of short circuit in printed circuits. Therefore, liquid-cooled heat dissipation is ...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K7/20
CPCH05K7/20345H05K7/20509H05K7/20381H05K7/20318H05K7/20327H05K7/20309Y02D10/00
Inventor 潘敏强易丽朱宏赐牛亚婷张颖
Owner SOUTH CHINA UNIV OF TECH