5results about How to "Adapt to cooling needs" patented technology

This specification discloses a heat dissipation system for an unmanned aerial vehicle (UAV), including a heat dissipation frame, an air duct cover, a cooling fan, and a dust filter. The heat dissipation frame is made of metal and includes a heat dissipation air duct body (with a first heat dissipation fin on its inner wall, overlapping the position of the air duct cover) and an outer mounting platform. The top is sealed by a first sealing gasket, and the bottom by a second sealing gasket, forming a sealed cavity. An air inlet is located at the front end of the heat dissipation air duct body, protected from water seepage by the sealing gasket. The air duct cover is fixed to the top of the frame by the sealing gasket, with a thermally conductive contact surface on its upper surface and a second heat dissipation fin on its lower surface, forming a heat dissipation path with the first heat dissipation fin. A dust filter is installed at the rear exhaust port of the heat dissipation frame, and the cooling fan is fixed to the air inlet, driving cool air to exchange heat through the two heat dissipation fins before exhausting it from the exhaust port.

The utility model provides a kind of power battery multi-module folding type welding cold plate structure, it is related to new energy battery technical field, including module cold plate assembly, first module cold plate and second module cold plate, the both sides of module cold plate assembly are equipped with edge, the front of edge is equipped with water outlet, the back of edge is equipped with water inlet, the end of water inlet and water outlet is equipped with sealing ring, the outside of module cold plate assembly includes cold plate outer wall, power battery multi-module folding type welding cold plate structure is designed by three kinds of assembly forms of module cold plate assembly, and the cooling demand of different battery module can be flexibly adapted. In the first form, first module cold plate and second module cold plate are integrated by welding and form sealing, internal S-shaped support septum is connected to form limiting step, provide high rigid support, suitable for high-strength battery module scene;The flexible of the second form of partition type design and reserved gap is enhanced, and the large deformation caused by cell expansion is adapted.

This invention discloses a liquid cooling system for a liquid-cooled computer room, relating to the field of liquid cooling heat dissipation. It includes: a cold source module comprising a cold source device, a main liquid supply pipeline, and a main liquid return pipeline, the cold source device forming a main cold source loop via the main liquid supply pipeline and the main liquid return pipeline; a heat exchange module comprising multiple heat exchangers connected to the main cold source loop; and a branch module comprising liquid-cooled copper busbar branches, battery pack branches, and liquid-cooled power supply module branches, each connected to the main cold source loop via a corresponding heat exchanger. This invention, by setting up a cold source module, heat exchange module, branch module, medium module, and control module, enables the liquid-cooled copper busbar branches, battery pack branches, and liquid-cooled power supply module branches to be connected to the main cold source loop via corresponding heat exchangers, thereby forming a multi-branch isolated liquid cooling architecture within the same liquid-cooled computer room.

The application provides a TO263T lead frame and a top heat dissipation packaged device. The frame comprises frame units arranged in a multi-row and multi-column array on a frame body. The frame units comprise a base island, an eighth pin, a seventh pin, a sixth pin and a fifth pin connected to one side of the base island and arranged in sequence with intervals, and a first pin, a second pin, a third pin and a fourth pin arranged in sequence with intervals on the other side of the base island and arranged in sequence with intervals. The plane where the base island, the eighth pin, the seventh pin, the sixth pin and the fifth pin are located has a height difference from the plane where the first pin, the second pin, the third pin and the fourth pin are located. The bottom surface of the base island is used for bonding a chip during packaging, and the top surface is used for exposing as a heat dissipation fin after packaging. Some pins are widened. The top heat dissipation packaged device comprises a plastic encapsulation body and a TO263T lead frame. The plastic encapsulation body wraps the frame units and the chip bonded on the base island. The scheme can achieve better heat dissipation effect and improve the utilization rate of the frame body material.

The utility model discloses a kind of multi-channel data transmission gateway, including shell, control module, LoRa gateway module, clock circuit, communication module, power module and storage module, the LoRa gateway module, clock circuit, communication module, power module and storage module are electrically connected with control module, the shell includes upper shell and lower shell, the open end of upper shell and lower shell is fixedly connected with flange, the flange on the upper shell both sides is fixedly connected with the rail of detachable connection with the flange on lower shell, the upper shell and lower shell both sides are provided with a plurality of cooling grooves.The utility model in the present application, by integrating a variety of positioning technology and communication means, data from different sources can be effectively collected, and through intelligent processing and optimization transmission strategy, meet the needs of various application scenarios, its work flow covers the whole process from data acquisition, processing, storage until the final transmission to target receiving end.