Spraying liquid cooling phase change module for server, control method and manufacturing method of spraying liquid cooling phase change module

A spray liquid and server technology, which is applied in the direction of using liquid cooling for modification, cooling/ventilation/heating modification, electrical equipment construction parts, etc., can solve uneven heat dissipation, and heat dissipation capacity cannot keep up with the heat dissipation requirements of servers with high heat flux density chips , Large demand for liquid cooling medium, etc., to achieve good cooling effect, reduce volume, and prolong service life

Active Publication Date: 2022-05-13
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The liquid cooling method in existing servers generally adopts external or built-in heat pipe micro-channel water-cooling modules, which have the disadvantages of large demand for liquid cooling medium and uneven heat dissipation, and the heat dissipation capacity still cannot keep up with the high heat flux density chips of servers The ever-increasing demand for cooling

Method used

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  • Spraying liquid cooling phase change module for server, control method and manufacturing method of spraying liquid cooling phase change module
  • Spraying liquid cooling phase change module for server, control method and manufacturing method of spraying liquid cooling phase change module
  • Spraying liquid cooling phase change module for server, control method and manufacturing method of spraying liquid cooling phase change module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] as Figure 1 As shown, a server spray cold phase change module, set on the server CPU chip or other high heat flow density chip, can be adjusted according to cooling needs, vertical or oblique installation can be, including phase change heat transfer module 1 and spray cooling module 2.

[0064] Further, the phase change heat transfer module includes a blow-up type vaporized plate or heat pipe or other phase change heat transfer element.

[0065] as Figure 2 As shown, the phase change heat transfer module 1 includes a heat pipe 11 and a fixed substrate 12, the heat pipe 11 and the fixed substrate 12 number is a plurality, divided into at least one group, the heat pipe 11 is connected to the fixed substrate 12, and is mounted on the CPU chip or other heating chip by the fixed substrate 12, all chip contact surfaces are uniformly coated with thermal grease.

[0066] The heat pipe 11 includes an evaporation end 111, an insulation end 112 and a condensation end 113; the fixed s...

Embodiment 2

[0088] as Figure 1 As shown, a server with a spray liquid cold phase change module, comprising a phase change heat transfer module 1 and a spray cooling module 2, the present embodiment differs from Example 1 in that the phase change heat transfer module 1 is a blown expansion type vaporized plate 13.

[0089] as Figure 5 and Figure 6 As shown, the inflatable vapor plate 13 includes an evaporation end 131, an insulation end 132 and a condensation end 133; the upper surface of the evaporation end 131 is convex, the lower surface is flat, the plane of the evaporation end is closely fitted to the chip, and the lamination surface is uniformly coated with silicone grease; the upper and lower surfaces of the condensation end 133 are flat, and one side is in contact with the bottom end of the spray liquid cold plate 26 of the spray cold module 26.

[0090] The manufacturing method of the present embodiment is different from Example 1 in that the phase change heat transfer module 1 and t...

Embodiment 3

[0093] as Figure 1 As shown, a server with a spray liquid cold phase change module, comprising a phase change heat transfer module 1 and a spray cooling module 2, the present embodiment differs from Example 1 in that the spray cooling module 2 is another form, comprising an inlet pipe 2-1, an outlet pipe 2-6 and sequentially stacked cover plate 2-2, a spray plate 2-3, an array pressure atomization nozzle 2-4, a spray liquid cold plate 2-5;

[0094] The inlet pipe 2-1 and the outlet pipe 2-6 may be disposed on the same side or different sides of the spray cooling module 2 as required;

[0095] as Figure 7 and Figure 8 As shown, the cover plate 2-2 has a cooling medium inlet 2-21, a conical cavity 2-22 and a cooling medium outlet 2-23, the cooling medium inlet 2-21 is connected to the inlet pipe 2-1, the cooling medium outlet 2-23 is connected with the outlet pipe 2-6;

[0096] The spray plate 2-3 is provided with an array threaded hole 2-31 and a cooling medium outlet 2-32;

[009...

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Abstract

The invention discloses a spraying liquid cooling phase change module for a server, a control method and a manufacturing method thereof, the spraying liquid cooling phase change module comprises a phase change heat transfer module and a spraying cooling module, the phase change heat transfer module comprises an evaporation end, a heat insulation end and a condensation end, and the condensation end is fixed with the spraying cooling module. The array type spraying layout is adopted, on one hand, the spraying area is increased, the cooling capacity acting on the heat exchange face is more uniform, and therefore the temperature of local hot spots generated due to uneven heat transfer in a server chip is reduced; on the other hand, on the premise of ensuring the spraying efficiency, the spraying height is reduced, and the size of the spraying cooling module is reduced.

Description

Technical field [0001] The present invention relates to a data center high heat flow density server heat dissipation technology field, specifically relates to a server spray liquid cold phase change module, control method and manufacturing method thereof. Background [0002] With the application of cloud computing, intelligent manufacturing, and big data technologies, data centers have become an important infrastructure to promote social progress. The high-density server equipment in the data center room is increasing, and the deployment of high-density server equipment is an inevitable trend in the development of data center construction, and the heat dissipation problem of high-heat flow density server has become the key to restricting the performance improvement of the server. [0003] Liquid cooling has gradually become the mainstream heat dissipation method of the server. The liquid cooling method in the existing server generally adopts the external or built-in heat pipe mi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2029H05K7/20309H05K7/20318H05K7/20381
Inventor 潘敏强易丽李超
Owner SOUTH CHINA UNIV OF TECH
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