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Film-like adhesive, method for evaluating disjunction properties thereof, dicing die-bonded film, method for manufacturing dicing die-bonded film, and semiconductor device

An evaluation method and adhesive technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, adhesives, etc., can solve problems such as wafer cracking

Pending Publication Date: 2022-06-07
株式会社力森诺科
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, defects such as wafer cracks are likely to occur during the dicing process.

Method used

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  • Film-like adhesive, method for evaluating disjunction properties thereof, dicing die-bonded film, method for manufacturing dicing die-bonded film, and semiconductor device
  • Film-like adhesive, method for evaluating disjunction properties thereof, dicing die-bonded film, method for manufacturing dicing die-bonded film, and semiconductor device
  • Film-like adhesive, method for evaluating disjunction properties thereof, dicing die-bonded film, method for manufacturing dicing die-bonded film, and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0098] A composition containing the following ingredients was prepared.

[0099] [Epoxy resin]

[0100] o-cresol novolak-type epoxy resin (manufactured by NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD., trade name: YDCN-700-10, epoxy equivalent: 210 g / eq, softening point 80°C): 22 parts by mass

[0101] Bisphenol F-type epoxy resin (manufactured by DIC Corporation, trade name: EXA-830CRP, epoxy equivalent: 160 g / eq, liquid at 25°C): 20 parts by mass

[0102] [Epoxy resin curing agent]

[0103] Phenolic resin (manufactured by Mitsui Chemicals, Inc., trade name: XLC-LL, softening point: 75°C): 32 parts by mass

[0104] [A silane coupling agent]

[0105] 3-mercaptopropyltrimethoxysilane (manufactured by Momentive Performance Materials Japan Inc., trade name: A-189): 0.1 part by mass

[0106] 3-ureidopropyltriethoxysilane (manufactured by Momentive Performance Materials Japan Inc., trade name: A-1160): 0.3 part by mass

[0107] [filler]

[0108] Silica (manufactured by Admatechs ...

Embodiment 2

[0116] A film-like adhesive was obtained in the same manner as in Example 1, except that the thickness was changed to 50 μm instead of 60 μm. The breakability of the film adhesive was evaluated at a temperature of 0°C. The results are shown in Table 1.

Embodiment 3

[0118] A composition containing the following ingredients was prepared.

[0119] [Epoxy resin]

[0120] o-cresol novolak-type epoxy resin (manufactured by NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD., trade name: YDCN-700-10, epoxy equivalent: 210 g / eq, softening point 80°C): 6 parts by mass

[0121] [Epoxy resin curing agent]

[0122] Phenolic resin (manufactured by AIR WATER INC., trade name: SK resin-HE100-C): 3 parts by mass

[0123] Phenolic resin (manufactured by Nippon Kayaku Co., Ltd., trade name: GPH-103): 3 parts by mass

[0124] [A silane coupling agent]

[0125] 3-mercaptopropyltrimethoxysilane (manufactured by Momentive Performance Materials Japan Inc., trade name: A-189): 0.5 part by mass

[0126] Phenylaminopropyltrimethoxysilane (manufactured by Momentive Performance Materials Japan Inc., trade name: Y9669): 1 part by mass

[0127] [filler]

[0128] Silica (manufactured by Admatechs Co., Ltd.): 30 parts by mass

[0129] [solvent]

[0130] · Cyclohexanone ...

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Abstract

One aspect of the present disclosure relates to a method for evaluating the breaking properties of a film-like adhesive under low-temperature conditions in which cooling expansion is performed, the method comprising: a step for preparing a sample having a cross-sectional area A (mm2) from a film-like adhesive; a step for determining the cutting work W (N.mm), the cutting strength P (N), and the cutting elongation L (mm) of the sample by a cutting test under low temperature conditions in the range of-15 DEG C to 0 DEG C; a step for determining a cleavage coefficient (m) represented by formula (1); and a step for determining the cutting resistance R (N / mm2) represented by formula (2). (1) m = W / [1000 * (P * L)], and (2) R = P / A.

Description

technical field [0001] The present disclosure relates to a film-like adhesive and a method for evaluating the breakability thereof, a dicing / die-bonding integrated film and a method for manufacturing the same, and a semiconductor device. Background technique [0002] A semiconductor device such as an integrated circuit (IC) is manufactured through the following steps, for example. First, a semiconductor wafer is attached to the pressure-sensitive film for dicing, and in this state, the semiconductor wafer is singulated into semiconductor chips (dicing step). After that, a pick-up process, a pressure-bonding process, a die-bonding process, and the like are performed. Patent Document 1 discloses a dicing die-bonding film having both a function of fixing a semiconductor wafer in a dicing process and a function of bonding a semiconductor chip and a substrate in a die-bonding process. In the dicing step, a chip with an adhesive sheet is obtained by dividing the semiconductor wa...

Claims

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Application Information

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IPC IPC(8): H01L21/52H01L21/301C09J7/38
CPCC09J7/38H01L21/6836H01L21/52C09J2301/312C09J2203/326H01L2221/68336H01L2221/68377
Inventor 山中大辅彼谷美千子
Owner 株式会社力森诺科