Vertically integrated electro-absorption modulated laser and method of manufacture

Abstract

Monolithically integrated electro-absorption modulated lasers (EMLs) and methods of manufacture are disclosed. A vertical stacked waveguide vertical integration for a distributed feedback (DFB) laser, an electro-absorption modulator (EAM), and a passive output waveguide, the DFB laser, the EAM, and the output waveguide being optically coupled using a lateral tapered vertical optical coupler. Vertical integration using transverse tapered vertical optical couplers provides an alternative for traditional docking coupling of lasers and EAMs, which is possible to improve reliability of high power operation with extended lifetime. Optionally, the EML includes monolithic integrated electronic circuitry, such as drive and control electronics of the DFB laser and EAM. Advantageously, the integrated EAM drive and control circuit includes a high speed electro-optic control loop for very high speed linearization and temperature compensation, e.g., enabling advanced modulation schemes, such as PAM-4 and DP-QPSK, for analog optical data center interconnect applications. Some embodiments are compatible with fabrication using a single epitaxial growth.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS [0002] This application claims priority to U.S. Provisional Patent Application No. 62 / 936,629, filed November 18, 2019, entitled "Vertically Integrated Electro-Absorption Modulated Lasers and Methods of Fabrication," The US Provisional Patent Application is incorporated herein by reference in its entirety. This application is related to US Patent Application No. 16 / , filed on December 10, 2019, entitled "Electro-Absorption Modulator with Integrated Control Loop for Linearization and Temperature Compensation" US Patent Application No. 708,887, filed January 31, 2019, entitled "Integrated Control Loop for Linearization and Temperature Compensation of an Electro-Absorption Modulator" Portion of US Patent Application Serial No. 16 / 263,169, which claims priority to US Provisional Patent Application No. 62 / 625,311, filed February 1, 2018, and has the same title; which is incorporated herein by reference in its entirety. technical fi...

AI Technical Summary

Problems solved by technology

High-performance modulation, such as PAM4, may not be possible with currently available low-cost transmitters, and discrete drive and control electronics

[0022] In some applications, currently available directly modulated or EML lasers cannot provide sufficient optical output power for long-distance optical interconnects, requiring the use of more sensitive avalanche photodiode detectors, which are expensive and have poor long-term reliability

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