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Resin composition and application thereof

A resin composition, epoxy resin technology, applied in the direction of epoxy resin glue, synthetic resin layered products, adhesive types, etc. Influence and other issues, to achieve the effect of controllable fluidity, good flexibility, and good filling ability

Pending Publication Date: 2022-06-28
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as an adhesive film, the resin composition mainly focuses on its adhesiveness, and does not pay attention to its glue filling ability and the influence on the flexibility, Tg and withstand voltage value of the copper clad laminate when used in the copper clad laminate.

Method used

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  • Resin composition and application thereof
  • Resin composition and application thereof
  • Resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] First, dissolve 3 parts of curing agent (DDS) and 2 parts of accelerator (2-PZ) with an appropriate amount of solvent, and stir for more than 60 minutes.

[0059] Then crystalline biphenyl epoxy resin, bisphenol A epoxy resin, core-shell rubber, acrylic resin and pre-treated alumina preform were added in sequence at a solid weight ratio of 20:10:5:5:60, and stirred for 4 For more than 1 hour, mix well to form a solution with a solid content of 70%.

[0060] The above solution was coated on the release film, dried in the air, and then baked in an oven at 130° C. for 3 minutes to obtain an adhesive film with a resin layer in a semi-cured state. The semi-cured adhesive film (thickness 100 μm) and copper foil (thickness 35 μm) are pressed together with the surface-treated aluminum plate (thickness 1.0 mm) to obtain an aluminum-based copper-clad laminate.

Embodiment 2-10

[0062] Except for changing the proportion of the resin mixture used in Example 1, the same method as in Example 1 was used to manufacture an adhesive film.

[0063] Table 1

[0064]

Embodiment 11

[0066] The copper foil (thickness 35μm), 1 piece of adhesive film (thickness 100μm) and 1 piece of adhesive sheet (ST115GB, 100μm) in Example 1 were pressed together on the circuit board with pre-made circuit, and the thickness of the circuit board was 140μm.

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PUM

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Abstract

The invention provides a resin composition and application thereof. The resin composition comprises the following components in percentage by weight: 10-60% of matrix resin and 40-90% of heat-conducting filler, wherein the matrix resin comprises 30-60% of crystalline epoxy resin, 25-40% of bisphenol epoxy resin, 5-20% of rubber and 5-20% of acrylic resin by taking the total weight of the matrix resin as 100%. According to the resin composition disclosed by the invention, a prepared adhesive film has relatively good flexibility, relatively high Tg value, controllable fluidity and good adhesive filling capability, and is a printed circuit board material which can be applied to a metal substrate, a flexible plate and a multi-layer laminated plate.

Description

technical field [0001] The invention belongs to the technical field of laminates, and relates to a resin composition and its application. Background technique [0002] With the mass production of electronic information products and the trend toward light, thin, short, and multi-functional designs, the printed circuit substrate, which is the main support for electronic components, is also continuously improving its technical level to provide high-density wiring, thin, and fine apertures. , High heat dissipation, under this background, high thermal conductivity copper clad laminates were born. The copper clad laminate is composed of glass cloth, resin and copper foil. The glass cloth can ensure the rigidity of the copper clad laminate. In order to improve the thermal conductivity of the copper clad laminate, a thermally conductive resin can be selected. However, due to the existence of the glass cloth, it is limited The thermal conductivity of the copper clad laminate is furt...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J133/02C09J109/02C09J113/00C09J11/04C09J7/10C09J7/30B32B15/092B32B15/18B32B15/20B32B27/38H05K1/03
CPCC09J163/00C09J11/04C09J7/10C09J7/30B32B15/092B32B15/18B32B15/20B32B27/38H05K1/036H05K1/0373C08L2201/08C08L2205/025C08L2205/035C08K2003/2227C08L63/00C08L33/02C08L9/02C08L13/00C08K3/22
Inventor 佘乃东黄增彪黄坚龙范华勇
Owner GUANGDONG SHENGYI SCI TECH