33results about How to "High Tg value" patented technology

The invention relates to modified epoxy acrylic resin and a preparation method thereof. The modified epoxy acrylic resin is mainly prepared from modified cycloaliphatic epoxy resin, acrylic monomers,a catalyst and a polymerization inhibitor, wherein the modified cycloaliphatic epoxy resin is prepared from raw materials in percentage by weight as follows: 65%-85% of polyfunctional cycloaliphatic epoxy resin, 14%-34% of methyl nadic anhydride and 0.1%-3% of a promoter, wherein the mole ratio of epoxy groups to acrylic monomers in the modified cycloaliphatic epoxy resin is 1:(0.7-1.5). The modified epoxy acrylic resin has good heat resistance, can reduce curing shrinkage and has lower viscosity. With addition of the modified epoxy acrylic resin, the Tg value of a UV curing product can be greatly increased, and the modified epoxy acrylic resin has better market prospects.

The invention discloses a composite plating treatment process of an electrolytic copper foil copper-based high polymer material. According to the process, original copper foil posttreatment equipment is adopted, and an auxiliary pulse power supply is additionally arranged. The composite plating treatment process comprises the following steps: (1) carrying out acid cleaning activation by adopting sulfuric acid H2SO4 to remove oxides from the surface of a copper foil; (2) carrying out copper-based composite plating, namely forming a composite plating layer of copper and the high polymer material on the surface of the copper foil and uniformly distributing a polar high polymer organic matter on the surface of the copper foil, wherein the polar end and the crystal structure of the copper plating layer are firmly fused and the non-polar end is exposed out of the surface of the plating layer, and thus a favorable binding force is formed between the copper foil and non-metal materials such as resin in a chemical bond manner; and (3) washing with water to remove a residual solution from the surface of the copper foil so as to prevent copper foil oxidation, and then entering into the subsequent processing procedure. According to the process disclosed by the invention, the roughness of the surface of the copper foil can be adjusted at will according to the development demands of the electronic industry, the copper foil with double smooth surfaces is produced, and the development trends of exquisite lines, high Tg value and high flexibility of a printed circuit board are met.

The invention provides a resin composition and a semi-flexible copper-clad plate prepared from the resin composition. The resin composition comprises the following components in parts by weight of: 60-70 parts of phosphorus-containing epoxy resin, 5-10 parts of novolac epoxy resin, 10-20 parts of bisphenol A epoxy resin modified through dimer acid addition, 10-20 parts of polyurethane modified epoxy resin and 2-4 parts of dicyandiamide. The resin composition is characterized in that the polyurethane modified epoxy resin and the bisphenol A epoxy resin modified through dimer acid addition are introduced so that the tenacity of the system is enhanced and the influence on the Tg of the system is low; as a result, the system is capable of achieving the balance between flexibility and Tg; the semi-flexible copper-clad plate made from resin composition has more excellent flexibility than common FR-4, and is capable of keeping a high Tg value.

The invention discloses a curing agent composition. The Tg value of the curing agent composition is improved through compounding of different types of two curing agents on the premise that the dosage is invariable.

The invention discloses a lead-free copper clad laminate with high toughness and high Tg and a preparation method thereof. The aliphatic or alicyclic diisocyanate is used to modify a liquid bisphenol A epoxy resin to obtain an isocyanate modified epoxy resin. Epichlorohydrin epoxidizes bisphenol A phenolic resin to obtain bisphenol A phenolic epoxy resin, which has the characteristics of high crosslinking density and good heat resistance. Phenol A and silica are prepared to form resin glue for glass fiber cloth impregnation, the resin glue is coated on glass fiber cloth and then dried, and then a plurality of glass fiber cloth impregnated sheets are stacked on one side of the glass fiber cloth. Or double-sided clad copper foil, and finally get high toughness and high Tg lead-free copper clad laminate after hot pressing and cooling. Performance is very good.

The invention provides a high-temperature, high-humidity and high-pressure-resistant, acid-alkali-resistant and high-adhesion roll-spray paint. The components of the roll-spray paint composition are: 10.0-20.0 parts of N-methylpyrrolidone, 5.0-10.0, methyl isobutyl ketone 5.0-10.0, BYK-163 1-15 parts, flake ceramic powder 0.5-2.0 parts, anti-settling agent 1-15 parts, polyimide resin 20-60 parts, halogen-free / 8-16 parts of low-halogen epoxy resin, 6-14 parts of anhydride curing agent, 0.2-5 parts of DMP-30, 0.5-2 parts of carbon black paste, 0.1-1.0 parts of KH-560, 0.2-0.4 parts of polyether silicone oil, The coating of the invention has the advantages of high temperature resistance, high humidity, high pressure and high adhesion, and can create unique value for the development of the world's electronic industry.

The invention discloses a curing agent composition. The curing agent composition has the beneficial effect that the Tg value of the curing agent composition is increased under the premise that the usage amount is not changed by compounding two different types of curing agents.

The invention belongs to the technical field of copper-clad plate preparation and in particular relates to a method for preparing a high Tg copper-clad plate. According to the method, by virtue of combination of raw materials of different molecular weights, the wettability of glass cloth can be improved, the Tg value can be further increased as special rigid molecule segments are introduced, the purpose of improving properties can be achieved together with other auxiliary materials and solvents, the Tg value of the copper-clad plate can be up to 210 degrees or greater, and the thermal stratification time T300 DEG C / minute is greater than 30; by increasing the Tg value of the copper-clad plate, the thermal resistance, the wet resistance, the chemical resistance and the stability of a circuit board can be improved, the problem that a circuit board is broken in the lead-free hot air solder level process of a circuit can be solved, and meanwhile, the circuit board manufacturing efficiencycan be also improved.

The invention discloses a curing agent composition. The curing agent composition has the beneficial effect that the Tg value of the curing agent composition is increased under the premise that the usage amount is not changed by compounding two different types of curing agents.

The invention discloses a curing agent composition. The curing agent composition has the beneficial effect that the Tg value of the curing agent composition is increased under the premise that the usage amount is not changed by compounding two different types of curing agents.

The invention discloses a curing agent composition. The curing agent composition has the beneficial effect that the Tg value of the curing agent composition is increased under the premise that the usage amount is not changed by compounding two different types of curing agents.

The invention discloses a curing agent composition, and belongs to the field of curing agents. Two different types of curing agents, namely, a component (1) and a component (2) are compounded, the Tg value of the curing agent is improved on the premise that the dosage of the curing agent is not changed, and the cost of the curing agent is reduced.

The invention provides a resin composition and a copper-clad plate manufactured from the same. The resin composition comprises the following components in parts by weight: 50-70 parts of phosphorus-containing epoxy resin, 5-10 parts of phenolic epoxy resin, 10-20 parts of modified epoxy resin with a silicone rubber core-shell structure, 10-20 parts of an organic silicon-epoxy block copolymer and 2-4 parts of dicyandiamide. The resin composition can not only strengthen the toughness of a system, but also ensure little influence on Tg of the system by introducing the modified epoxy resin with the silicone rubber core-shell structure and the organic silicon-epoxy block copolymer; compared with ordinary FR-4, the copper-clad plate manufactured by using the resin composition has better flexural property and can keep a higher Tg value.