33results about How to "High Tg value" patented technology

The invention discloses a high dirt resistance exterior wall latex paint capable of degrading haze and a production process thereof. The high dirt resistance exterior wall latex paint capable of degrading the haze comprises raw materials with percentage by weight: water 15.0-25.0%, alkali swelling thickening agents 0.5-1.0%, potential of hydrogen (pH) adjusting agents 0.1-0.2%, antifoaming agents 0.2-0.5%, wetting agents 0.1-0.3%, dispersing agents 0.3-0.6%, ethylene glycol 1.5-2.5%, coalescing agents 1.8-2.5%, titanium dioxide 0-20.0%, ground calcium carbonate 20.0-30.0%, titanium dioxide 0.2-0.6%, silicone modified acrylate emulsion 30.0-40.0%, bactericide 0.2-0.4% and polyurethane thickening agents 0.2-0.5%. The production process of the high dirt resistance exterior wall latex paint capable of degrading the haze comprises two stages of pulping and paint mixing. The high dirt resistance exterior wall latex paint capable of degrading the haze accords with national standard GB/T9755-2014 performance features of exterior wall latexes, and further has the functions of haze degrading and high dirt resistance.

The invention discloses a composite plating treatment process of an electrolytic copper foil copper-based high polymer material. According to the process, original copper foil posttreatment equipment is adopted, and an auxiliary pulse power supply is additionally arranged. The composite plating treatment process comprises the following steps: (1) carrying out acid cleaning activation by adopting sulfuric acid H2SO4 to remove oxides from the surface of a copper foil; (2) carrying out copper-based composite plating, namely forming a composite plating layer of copper and the high polymer material on the surface of the copper foil and uniformly distributing a polar high polymer organic matter on the surface of the copper foil, wherein the polar end and the crystal structure of the copper plating layer are firmly fused and the non-polar end is exposed out of the surface of the plating layer, and thus a favorable binding force is formed between the copper foil and non-metal materials such as resin in a chemical bond manner; and (3) washing with water to remove a residual solution from the surface of the copper foil so as to prevent copper foil oxidation, and then entering into the subsequent processing procedure. According to the process disclosed by the invention, the roughness of the surface of the copper foil can be adjusted at will according to the development demands of the electronic industry, the copper foil with double smooth surfaces is produced, and the development trends of exquisite lines, high Tg value and high flexibility of a printed circuit board are met.

The invention provides a resin composition and a semi-flexible copper-clad plate prepared from the resin composition. The resin composition comprises the following components in parts by weight of: 60-70 parts of phosphorus-containing epoxy resin, 5-10 parts of novolac epoxy resin, 10-20 parts of bisphenol A epoxy resin modified through dimer acid addition, 10-20 parts of polyurethane modified epoxy resin and 2-4 parts of dicyandiamide. The resin composition is characterized in that the polyurethane modified epoxy resin and the bisphenol A epoxy resin modified through dimer acid addition are introduced so that the tenacity of the system is enhanced and the influence on the Tg of the system is low; as a result, the system is capable of achieving the balance between flexibility and Tg; the semi-flexible copper-clad plate made from resin composition has more excellent flexibility than common FR-4, and is capable of keeping a high Tg value.

The invention relates to modified epoxy acrylic resin and a preparation method thereof. The modified epoxy acrylic resin is mainly prepared from modified cycloaliphatic epoxy resin, acrylic monomers,a catalyst and a polymerization inhibitor, wherein the modified cycloaliphatic epoxy resin is prepared from raw materials in percentage by weight as follows: 65%-85% of polyfunctional cycloaliphatic epoxy resin, 14%-34% of methyl nadic anhydride and 0.1%-3% of a promoter, wherein the mole ratio of epoxy groups to acrylic monomers in the modified cycloaliphatic epoxy resin is 1:(0.7-1.5). The modified epoxy acrylic resin has good heat resistance, can reduce curing shrinkage and has lower viscosity. With addition of the modified epoxy acrylic resin, the Tg value of a UV curing product can be greatly increased, and the modified epoxy acrylic resin has better market prospects.

The invention discloses a making method for a high TG halogen-free LOW Dk/Df copper-clad plate. The method comprises the steps of: 1. glue solution preparation: adopting a modified multifunctional phosphorous series epoxy resin/amine curing system, adding o-cresol epoxy resin and bisphenol A cyanate ester resin, then adding a curing agent, a curing accelerator and an inorganic filler; taking any one of or a composition of over one of acetone, propylene glycol methyl ether acetate and butanone as the solvent to prepare the glue solution; 2. cementing: using an NE glass fiber cloth with a low dielectric constant as a reinforcing material and conducting soaking in the prepared glue solution, and making a B stage prepreg by a vertical cementing machine; and 3. superimposition and hot pressing: superimposing the well cemented prepreg, and carrying out compression moulding by a vacuum hot pressing machine. The halogen-free copper-clad plate prepared by the method provided by the invention has a TG value over 170DEG C, and also has a low dielectric constant and dielectric loss special performance, a Df value lower than 3.8 and a Df value lower than 0.07, thus fully meeting the requirements for making high frequency and high speed circuit boards. At the same time, the high TG halogen-free LOW Dk/Df copper-clad plate also has excellent heat resistance, hot cracking decomposition temperature and other excellent performance, etc.

The invention discloses a technology for producing a high-frequency microwave copper-clad plate with a dielectric constant of 3.4. The technology comprises the following steps: dissolving modifying polyphenyl ether resin, dip-coating a glass fabric, stacking with a copper foil, laminating at high temperature and high pressure, testing performance and cutting packages, wherein a crosslinked body with an appropriate molecular weight is formed by the allylation modification of the polyphenyl ether resin, then the glass fiber fabric is dipped in the crosslinked body to form a prepreg, and the prepreg is laminated together with the copper foil to produce the high-frequency copper-clad plate.

A multifunctional aromatic amine hardener composition including the reaction condensation product of (a) at least one aniline and (b) at least one non-aromatic cyclic dicarboxaldehyde; and a reactive thermosettable resin composition including (i) at least one multifunctional aromatic amine hardener composition curing agent, (ii) at least one thermoset resin, and optionally (c) at least one catalyst; and a process for preparing a thermoset product from the thermosettable composition. The hardener composition above and a thermoset resin may be used to prepare a thermoset product with improved thermo-mechanical behavior.

The invention discloses a triphenyl-based organic compound, an organic electroluminescent material and a device, the structural formula of the triphenyl-based organic compound is shown in the following formula (I): R is any one of hydrogen, deuterium, halogen atom, cyano, substituted or unsubstituted C1-C5 alkyl, substituted or unsubstituted C6-C30 aromatic group, and substituted or unsubstituted C5-C30 heteroaromatic group; X, Y and Z are respectively and independently CH or N, and at least one of X, Y and Z is N; m, s and n are respectively and independently 0 or 1; the organic compound is used as the electron transport layer so that the driving voltage of the device can be greatly reduced, the consumption of electric energy is greatly reduced, the luminous efficiency is remarkably improved, and in addition, the service life of the organic light-emitting device is remarkably prolonged by reducing the driving voltage.

The invention provides a resin composition, which comprises the following components in parts by weight: 5 to 30 parts of alicyclic epoxy resin; 10-60 parts by weight of aromatic epoxy resin; 5 to 60 parts by weight of bismaleimide resin; wherein the molecular structural formula of the alicyclic epoxy resin is shown as a formula (1); in the formula (1), n is an integer of 1-10. The resin composition contains aliphatic epoxy resin and bismaleimide resin with specific structures, and prepregs and laminated boards prepared from the resin composition have the characteristics of high CTI value and Tg value, excellent humidity and heat resistance, low water absorption, excellent flame retardance and the like.

The invention provides a water-based acrylic emulsion with high barrier and high water resistance. The water-based acrylic emulsion is prepared from the following components in percentage by weight: 10 to 50 percent of acrylate mixture, 1 to 10 percent of film-forming agent, 0.5 to 2 percent of wetting agent, 1 to 3 percent of compound emulsifier, 0.2 to 0.5 percent of defoaming agent, 0.1 to 0.3 percent of preservative, 0.1 to 0.3 percent of initiator, 0.1 to 0.2 percent of pH (Potential of Hydrogen) regulator and 35 to 87 percent of soft water. The water-based acrylic emulsion disclosed by the invention has good barrier property on formaldehyde, can effectively reduce the release amount of formaldehyde, has excellent water resistance, and can be widely applied to exterior wall coatings and wooden furniture coatings; the emulsion is a pure water-based material, is environment-friendly and non-toxic and has no pungent smell, and the coating is transparent and high in gloss.

The invention discloses a curing agent composition. The Tg value of the curing agent composition is improved through compounding of different types of two curing agents on the premise that the dosage is invariable.

The invention discloses a curing agent composition. The curing agent composition has the beneficial effect that the Tg value of the curing agent composition is increased under the premise that the usage amount is not changed by compounding two different types of curing agents.

The invention discloses a curing agent composition. The curing agent composition has the beneficial effect that the Tg value of the curing agent composition is increased under the premise that the usage amount is not changed by compounding two different types of curing agents.

The invention discloses a curing agent composition. The curing agent composition has the beneficial effect that the Tg value of the curing agent composition is increased under the premise that the usage amount is not changed by compounding two different types of curing agents.

The invention relates to a white-light adhesive capable of reducing the light attenuation speed of LED lamp beads. The molecular formula of the white-light adhesive is A(5-X)B(5-X)O(1-X), wherein A is at least one of elements Si, N and C; B is at least one of elements H and F; O is the oxygen element; X is 1-20; A is prepared from the following components in parts by weight: 30-50 parts of cycloaliphatic epoxy resin, 30-50 parts of solid-state special epoxy resin and 30-40 parts of toughening epoxy resin; and B is prepared from the following components in parts by weight: 60-90 parts of anhydride polymer curing agent, 1-5 parts of oxanilide absorbent, 1-5 parts of hindered amine light stabilizer, 5-10 parts of phosphite antioxidant and 10-20 parts of urea modified accelerator. The finished product of an encapsulated white-light adhesive provided by the invention has the advantages of high Tg value and good resistance to yellowing and weather; and the service life is prolonged by reducing the LED light attenuation.

The invention discloses a curing agent composition, and belongs to the field of curing agents. Two different types of curing agents, namely, a component (1) and a component (2) are compounded, the Tg value of the curing agent is improved on the premise that the dosage of the curing agent is not changed, and the cost of the curing agent is reduced.

The invention discloses a method for preventing test stripping of solder resist paste flux, and the method comprises the following steps: carrying out the early-stage processing of a PCB workpiece, and generating a to-be-processed workpiece; treating the to-be-treated workpiece with the super-roughening liquid, and generating a roughened workpiece; carrying out the solder resist printing; after primary pre-baking, carrying out the exposure and development treatment, and carrying out the post-baking; coating flux paste for testing, and carrying out ultraviolet curing treatment; and checking whether the cured product meets the requirements or not: if so, carrying out later process treatment. The Tg value of printing ink can be increased after solder resist high-temperature curing, the stability, the reliability, the heat resistance and the chemical resistance of a finished PCB are improved, and the thermal expansion coefficient is reduced; meanwhile, the physical shape of the copper surface can be improved through super roughening, the crystal structure can be changed microcosmically, the copper surface can be activated, the super roughened copper surface and a solder resist film can form chemical bonds more easily, the solder paste test solder resist stripping risk is reduced, and the problems of solder resist test stripping and bubbling are solved.

The invention discloses a curing agent combination. Through compounding of two different types of curing agents, a Tg value is improved under this premise of no change of a use amount.

The invention discloses a flame retardant which is polyfunctional epoxy phosphate and has a structure shown in a formula I. The invention also provides a preparation method of the flame retardant, the preparation method comprises the following steps: (1) dehydrating chloropropanediol, dropwise adding a mixed solution of phosphorus trichloride and toluene for reaction, and controlling the reaction temperature to be 25-35 DEG C; raising the temperature to 135 DEG C and vacuumizing to obtain chlorohydrin ether phosphate; (2) adding phenol into the product of the step (1), controlling the temperature to be 80-90 DEG C, adding formaldehyde in batches, and keeping the temperature for 2 hours to obtain chlorohydrin ether phenolic phosphate; and (3) adding epichlorohydrin into the product obtained in the step (2), cooling to 65 DEG C, carrying out reduced pressure reflux, dropwise adding NaOH, adding a proper amount of water and toluene, layering, taking out the upper layer, and removing toluene to obtain the polyfunctional epoxy phosphate. The flame retardant property of the epoxy resin can be improved, the raw materials for synthesizing the epoxy phosphate are easy to obtain and low in cost, the process is simple, and the cost is low.