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Method for preventing solder resist paste from stripping in test

A technology of solder paste and solder resist, which is applied in the direction of circuit inspection/monitoring/correction, electrical components, printed circuit manufacturing, etc., can solve problems such as blistering, solder resist test peeling, etc., to improve stability, improve bonding force, The effect of lowering the coefficient of thermal expansion

Pending Publication Date: 2021-09-17
GUANGZHOU MEADVILLE ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the deficiencies in the prior art, one of the purposes of the present invention is to provide a method for preventing the peeling of the solder resist solder paste test, which can solve the problems of solder resist test peeling and foaming

Method used

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  • Method for preventing solder resist paste from stripping in test

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Embodiment Construction

[0027] Below, the present invention will be further described in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of not conflicting, the various embodiments described below or the technical features can be combined arbitrarily to form new embodiments. .

[0028] It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or there can also be an intervening component. When a component is said to be "connected" to another component, it may be directly connected to the other component or there may be intervening components at the same time. When a component is said to be "set on" another component, it may be set directly on the other component or there may be an intervening component at the same time. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only.

[0029] Un...

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Abstract

The invention discloses a method for preventing test stripping of solder resist paste flux, and the method comprises the following steps: carrying out the early-stage processing of a PCB workpiece, and generating a to-be-processed workpiece; treating the to-be-treated workpiece with the super-roughening liquid, and generating a roughened workpiece; carrying out the solder resist printing; after primary pre-baking, carrying out the exposure and development treatment, and carrying out the post-baking; coating flux paste for testing, and carrying out ultraviolet curing treatment; and checking whether the cured product meets the requirements or not: if so, carrying out later process treatment. The Tg value of printing ink can be increased after solder resist high-temperature curing, the stability, the reliability, the heat resistance and the chemical resistance of a finished PCB are improved, and the thermal expansion coefficient is reduced; meanwhile, the physical shape of the copper surface can be improved through super roughening, the crystal structure can be changed microcosmically, the copper surface can be activated, the super roughened copper surface and a solder resist film can form chemical bonds more easily, the solder paste test solder resist stripping risk is reduced, and the problems of solder resist test stripping and bubbling are solved.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a method for preventing the test stripping of solder resist and solder paste. Background technique [0002] At present, the main function of the solder resist coating in the solder resist process in the PCB industry is to reduce the consumption of solder on the non-soldering area, prevent bridging and short circuits between lines during soldering, improve the permanent electrical environment and chemical resistance protection layer, and prevent the board surface When exposed to moisture and external damage, the printed board is more beautiful with a beautiful "coat". The solder paste used in the mounting process is corrosive to a certain extent. After the mounting is completed, the surface layer of the solder mask will be corroded by the solder paste, resulting in blistering and peeling of the solder mask. In order to improve the reliability of solder resist inks, some downstream a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28H05K3/38H05K3/34
CPCH05K3/282H05K3/383H05K3/3457H05K2203/16
Inventor 彭浪祥肖彩何锦添
Owner GUANGZHOU MEADVILLE ELECTRONICS
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