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Making method for high TG halogen-free LOW Dk/Df copper-clad plate

A manufacturing method and copper-clad laminate technology, applied in chemical instruments and methods, lamination auxiliary operations, lamination, etc., can solve problems such as unsuitable high-frequency circuit boards, achieve high glass transition temperature, low dielectric constant, The effect of good heat resistance

Inactive Publication Date: 2014-08-27
NANTONG RODA ELECTRON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, in the printed circuit board industry, most of the halogen-free copper-clad laminates have a TG value of about 150°C, a dielectric constant (Dk) > 4.5, and a dielectric loss (Df) > 0.12. This type of board is not suitable for making high-frequency circuits. plate

Method used

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  • Making method for high TG halogen-free LOW Dk/Df copper-clad plate
  • Making method for high TG halogen-free LOW Dk/Df copper-clad plate
  • Making method for high TG halogen-free LOW Dk/Df copper-clad plate

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Embodiment Construction

[0023] The present invention will be further described in detail below through specific embodiments.

[0024] The manufacturing method of the high TG halogen-free LOW Dk / Df copper clad laminate provided by the present invention includes the steps of: disposing glue liquid-gluing-lamination and hot pressing.

[0025] S1: Preparation of glue

[0026] The glue composition includes (parts by weight):

[0027]

[0028]

[0029] The glue is prepared according to the above components, and the gel is evenly stirred, and the gel time is 288S;

[0030] The modified polyfunctional phosphorus-based epoxy resin with an epoxy equivalent of 345 g / eq and a phosphorus content of 2.6% is an epoxy resin modified by DOPO-based epoxy resin by adding a polyfunctional resin and a propanol phenol resin. The main features are: wide working window, high Tg value of the substrate made with it, good heat resistance and flame resistance, etc.;

[0031] Ortho-cresol type epoxy resin with epoxy equivalent of 210g / eq;...

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Abstract

The invention discloses a making method for a high TG halogen-free LOW Dk / Df copper-clad plate. The method comprises the steps of: 1. glue solution preparation: adopting a modified multifunctional phosphorous series epoxy resin / amine curing system, adding o-cresol epoxy resin and bisphenol A cyanate ester resin, then adding a curing agent, a curing accelerator and an inorganic filler; taking any one of or a composition of over one of acetone, propylene glycol methyl ether acetate and butanone as the solvent to prepare the glue solution; 2. cementing: using an NE glass fiber cloth with a low dielectric constant as a reinforcing material and conducting soaking in the prepared glue solution, and making a B stage prepreg by a vertical cementing machine; and 3. superimposition and hot pressing: superimposing the well cemented prepreg, and carrying out compression moulding by a vacuum hot pressing machine. The halogen-free copper-clad plate prepared by the method provided by the invention has a TG value over 170DEG C, and also has a low dielectric constant and dielectric loss special performance, a Df value lower than 3.8 and a Df value lower than 0.07, thus fully meeting the requirements for making high frequency and high speed circuit boards. At the same time, the high TG halogen-free LOW Dk / Df copper-clad plate also has excellent heat resistance, hot cracking decomposition temperature and other excellent performance, etc.

Description

Technical field [0001] The invention relates to the field of copper clad laminates, in particular to a method for manufacturing high TG halogen-free LOW Dk / Df copper clad laminates suitable for high-frequency circuit boards. Background technique [0002] Following the successive implementation of the European Union and Mainland China’s ROHS, substances containing lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers are no longer allowed to be used in the manufacture of electronic products or their components; Greenpeace ( Green Peace) The greening policy vigorously promoted at this stage requires all manufacturers to completely exclude brominated flame retardants and polyvinyl chloride in their electronic products to comply with both lead-free and halogen-free green electronics. However, there are still many circuit board industries that use bromine-containing compounds because brominated flame retardants have excellent flame re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/04B32B27/18B32B27/38B32B15/092B32B37/06B32B38/00C08L63/00C08L79/04C08K3/22C08K3/36
Inventor 包晓剑罗光俊
Owner NANTONG RODA ELECTRON
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