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Lead-free copper clad laminate with high toughness and high tg and preparation method thereof

A lead-free copper clad laminate, high toughness technology, used in chemical instruments and methods, flat products, other household appliances, etc., can solve the problems of sheet toughness and adhesion discount, low CTE, low water absorption, etc., to reduce sheet rigidity and high brittleness, excellent PCB processability, and high crosslinking density

Active Publication Date: 2021-05-04
江苏联鑫电子工业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, ordinary lead-free Tg (180°C) copper clad laminates rely on increasing resin crosslinking density, increasing inorganic fillers, and using phenolic curing to achieve high Tg lead-free compatibility of the board, which undoubtedly greatly reduces the toughness and adhesion of the board. With high Tg, high heat resistance, low CTE, low water absorption, and low CAF, the rigidity and brittleness of the material increase and the adhesion decreases, which sacrifices the processability of the PCB industry

Method used

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  • Lead-free copper clad laminate with high toughness and high tg and preparation method thereof
  • Lead-free copper clad laminate with high toughness and high tg and preparation method thereof
  • Lead-free copper clad laminate with high toughness and high tg and preparation method thereof

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Experimental program
Comparison scheme
Effect test

specific Embodiment 1

[0021] S1: Preparation of resin glue: weigh 350 parts of phenolic resin, 200 parts of isocyanate modified epoxy resin, 150 parts of bisphenol A novolac epoxy resin, 1 part of boric acid, 150 parts of tetrabromobisphenol A ( TBBA) and 250 parts of silicon dioxide raw material components, the raw material components will be weighed into the mixer at 30 ° C after stirring for 4h, to obtain the resin glue;

[0022] Among them, the isocyanate modified epoxy resin is obtained by the following preparation method: first, 70 parts by weight of liquid bisphenol A type epoxy resin is put into the reactor for stirring and heated to 150 °C, and then slowly add 120 parts by weight of diisocyanate HDI React with 1 weight part of catalyst acetylacetone while stirring, and obtain isocyanate-modified epoxy resin after the reaction finishes.

[0023] Wherein the bisphenol A novolak epoxy resin is obtained by the following preparation method: epoxidize 80 parts by weight of bisphenol A novolac re...

specific Embodiment 2

[0028] S1: Preparation of resin glue: weigh 400 parts of phenolic resin, 250 parts of isocyanate modified epoxy resin, 200 parts of bisphenol A novolac epoxy resin, 3 parts of boric acid, 200 parts of tetrabromobisphenol A ( TBBA) and 300 parts of silicon dioxide raw material components, adding the obtained raw material components into a mixer and stirring at 40 ° C for 6 hours to obtain a resin glue;

[0029] Among them, the isocyanate modified epoxy resin is obtained by the following preparation method: first, put 80 parts by weight of liquid bisphenol A type epoxy resin into the reactor and stir it and heat it to 120°C, then slowly add 130 parts by weight of diisocyanate IPDI React with 3 parts by weight of catalyst acetylacetone while stirring, and obtain isocyanate modified epoxy resin after the reaction finishes.

[0030] The bisphenol A novolac epoxy resin is obtained by the following preparation method: epoxidize 120 parts by weight of bisphenol A novolac resin with 12...

specific Embodiment 3

[0035] S1: Preparation of resin glue: Weigh 380 parts of phenolic resin, 230 parts of isocyanate modified epoxy resin, 180 parts of bisphenol A novolac epoxy resin, 2 parts of boric acid, 180 parts of tetrabromobisphenol A ( TBBA) and 260 parts of silicon dioxide raw material components, adding the obtained raw material components into a mixer and stirring at 35 ° C for 5 hours to obtain a resin glue;

[0036]Among them, the isocyanate modified epoxy resin is obtained by the following preparation method: first, 75 parts by weight of liquid bisphenol A epoxy resin epoxy resin is put into the reactor for stirring and heated to 160 °C, and then slowly added diisocyanate HDMI 125 parts by weight and 2 parts by weight of catalyst acetylacetone and react while stirring, and obtain isocyanate-modified epoxy resin after the reaction finishes.

[0037] The bisphenol A novolak epoxy resin is obtained by the following preparation method: epoxidize 100 parts by weight of bisphenol A novol...

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Abstract

The invention discloses a lead-free copper clad laminate with high toughness and high Tg and a preparation method thereof. The aliphatic or alicyclic diisocyanate is used to modify a liquid bisphenol A epoxy resin to obtain an isocyanate modified epoxy resin. Epichlorohydrin epoxidizes bisphenol A phenolic resin to obtain bisphenol A phenolic epoxy resin, which has the characteristics of high crosslinking density and good heat resistance. Phenol A and silica are prepared to form resin glue for glass fiber cloth impregnation, the resin glue is coated on glass fiber cloth and then dried, and then a plurality of glass fiber cloth impregnated sheets are stacked on one side of the glass fiber cloth. Or double-sided clad copper foil, and finally get high toughness and high Tg lead-free copper clad laminate after hot pressing and cooling. Performance is very good.

Description

technical field [0001] The invention relates to a copper clad laminate and a preparation method thereof, in particular to a lead-free copper clad laminate with high toughness and high Tg and a preparation method thereof, belonging to the technical field of copper clad laminate processing. Background technique [0002] Copper Clad Laminate (CCL) is the main material for the manufacture of printed circuit boards (PCB), so it is also an indispensable basic electronic material for the complete machine and components of any electronic product. With the rapid development of the PCB industry, the market demand for high-performance copper-clad laminates is increasing day by day. In the era of lead-free development, it is becoming more and more mature. In addition to the heat resistance, Tg value, and CTE value of the product, it is highly regarded. In addition to attention, the toughness of the material, PCB processability, and adhesion have also become a focus of attention. The bal...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C70/30B29C65/02B32B5/26B32B15/04B32B15/14C08L61/06C08L63/00C08K13/04C08K7/14C08K3/38C08K3/36C08K5/136B29L7/00B29L9/00B29L31/34
Inventor 汪小琦
Owner 江苏联鑫电子工业有限公司
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