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A kind of preparation method of high tg copper clad laminate

A copper-clad laminate and epoxy resin technology, applied in the direction of chemical instruments and methods, applications, and other household appliances, to achieve the effects of improving production efficiency, solving cracking boards, and improving stability

Active Publication Date: 2020-12-22
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The typical lead-free reflow soldering conditions are 245-265°C for 1 minute; the peak temperature of maintenance soldering will reach 300°C. In order to improve soldering reliability and work efficiency, even higher temperatures are required, and traditional copper-clad laminates cannot meet the needs.

Method used

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  • A kind of preparation method of high tg copper clad laminate

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Comparison scheme
Effect test

Embodiment 1

[0032] A preparation method of high Tg copper clad laminate, the steps are as follows:

[0033] (1) Preparation of glue solution: according to parts by weight, 8 parts of bisphenol F type epoxy resin, 20 parts of modified anhydride containing naphthalene ring, 20 parts of bisphenol F type brominated epoxy resin, tetraphenol ethane 5 parts of glycidyl ether, 3 parts of polyphenylene ether modified epoxy resin, 30 parts of naphthalene ring type benzoxazine resin, 20 parts of silicon micropowder and 20 parts of toluene are mixed to make glue;

[0034] (2) Use reinforcing material to dip the glue in step (1), and bake to make prepreg; under IPC standard detection, the prepreg reaches: fluidity 5-35%, gelation time 50-150s; prepreg air bubble content is: In the area of ​​4"*4", the diameter of the bubbles is ≤40μm, the number of bubbles with a diameter of 20-40μm is less than 2, and the number of bubbles with a diameter of 10-20μm is less than 5;

[0035] (3) Take 5 sheets of prep...

Embodiment 2

[0037] A preparation method of high Tg copper clad laminate, the steps are as follows:

[0038] (1) Preparation of glue: according to parts by weight, 9 parts of bisphenol A type epoxy resin, 18 parts of dicyclopentadiene maleic anhydride, 15 parts of bisphenol A type brominated epoxy resin, tetraphenol ethane 8 parts of glycidyl ether, 2 parts of isocyanate modified epoxy resin, 25 parts of bisphenol A benzoxazine resin and 25 parts of acetone are mixed to make glue;

[0039] (2) Use reinforcing material to dip the glue in step (1), and bake to make prepreg; under IPC standard detection, the prepreg reaches: fluidity 5-35%, gelation time 50-150s; prepreg air bubble content is: In the area of ​​4"*4", the diameter of the bubbles is ≤40μm, the number of bubbles with a diameter of 20-40μm is less than 2, and the number of bubbles with a diameter of 10-20μm is less than 5;

[0040] (3) Take 5 sheets of prepregs and add metal foil on one side of the prepregs. The rough surface of...

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Abstract

The invention belongs to the technical field of copper-clad plate preparation and in particular relates to a method for preparing a high Tg copper-clad plate. According to the method, by virtue of combination of raw materials of different molecular weights, the wettability of glass cloth can be improved, the Tg value can be further increased as special rigid molecule segments are introduced, the purpose of improving properties can be achieved together with other auxiliary materials and solvents, the Tg value of the copper-clad plate can be up to 210 degrees or greater, and the thermal stratification time T300 DEG C / minute is greater than 30; by increasing the Tg value of the copper-clad plate, the thermal resistance, the wet resistance, the chemical resistance and the stability of a circuit board can be improved, the problem that a circuit board is broken in the lead-free hot air solder level process of a circuit can be solved, and meanwhile, the circuit board manufacturing efficiencycan be also improved.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminate preparation, and in particular relates to a preparation method of a high-Tg copper-clad laminate. Background technique [0002] With the development of electronic products, the number of electrical components carried per unit area increases, and the line width and line spacing decrease (below 50 μm), which puts forward higher load carrying, processing, heat resistance, moisture resistance, chemical resistance, Resistance to stability and other requirements; and since the implementation of WEEE and RoHS in the European Union, the electronics industry has entered the era of lead-free soldering. [0003] ROHS will directly affect the reflow soldering, wave soldering conditions and maintenance soldering temperature in the installation process of electronic products. The typical lead-free reflow soldering conditions are 245-265°C for 1 minute; the peak temperature of repair soldering will...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/00B32B37/10C08L61/34C08L63/00C08L71/12C08L1/02C08K7/14C08K3/36C08G59/42
CPCB32B37/00B32B37/10B32B2307/306B32B2307/726B32B2457/08C08G59/4207C08L61/34C08L2201/02C08L2201/08C08L2205/025C08L2205/03C08L2205/035C08L2312/00C08L63/00C08L71/12C08L1/02C08K7/14C08K3/36
Inventor 陈长浩刘雪萍秦伟峰付军亮陈晓鹏朱义刚
Owner SHANDONG JINBAO ELECTRONICS
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