Spaceflight thermal control system enhanced condensing device based on space dot-matrix foam metal

Abstract

The invention relates to a spaceflight thermal control system enhanced condensation device based on space dot-matrix foam metal. The spaceflight thermal control system enhanced condensation device comprises a shell, condensation heat exchange pipes and the foam metal. Water circulates in the condensation heat exchange tube, refrigerant circulates outside the condensation heat exchange tube, and the outer wall outside the condensation heat exchange tube is filled with a through hole foam metal structure with high hole density. The foam metal is of a filling structure of a space dot-matrix pyramid foam metal enhanced heat exchange framework. Belongs to the field of spaceflight thermal control system devices, along with rapid increase of the heat flux density of high-performance and high-integration electronic devices in the field of spaceflight systems, a water cooling mode is adopted to replace a traditional air cooling mode, and meanwhile heat exchange is conducted in the mode that high-hole-density foam metal is adopted outside a tube to replace a finned tube. While the heat exchange area is increased by the foam metal, the foam metal filling structure of the space dot-matrix reinforced heat exchange framework can greatly reduce the influence of flow resistance, the heat exchange effect is remarkably improved, and efficient heat dissipation is achieved in a limited space.

Description

technical field [0001] The invention relates to the technical field of aerospace thermal control system devices, in particular to an aerospace thermal control system enhanced condensation device based on space lattice foam metal. Background technique [0002] A reliable and efficient thermal control system is one of the primary prerequisites to ensure the safe operation of manned people. With the rapid development of aerospace vehicle manufacturing technology, the thermal reliability indicators of its on-board electronic and electrical equipment are becoming more and more stringent. The heat transfer capacity and temperature uniformity of the heat-carrying device put forward higher requirements. However, traditional electronic cooling solutions such as natural convection, forced convection, and heat pipe cooling can no longer meet the needs. The traditional air-cooled condensing device has high condensation pressure, large power consumption, and unsatisfactory heat exchange...

AI Technical Summary

Problems solved by technology

However, the special structure of through-hole metal foam not only enhances the heat transfer coefficient, but also increases the resistance. Therefore, how to coordinate its flow heat transfer characteristics and resistance characteristics has become a difficult research point.

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