LED light source for direct writing photoetching

Abstract

The invention provides an LED light source for direct writing photoetching, comprising: a heat dissipation member provided with a cooling cavity for accommodating a cooling fluid, the heat dissipation member having a heat dissipation surface, the heat dissipation surface being provided with a plurality of accommodating portions concavely extending into the cooling cavity, the surfaces of the accommodating portions concavely extending into the cooling cavity being arc-shaped surfaces; the plurality of light-emitting parts are respectively arranged in the plurality of accommodating parts; each heat conduction piece is arranged on one light-emitting piece in a covering mode, and the ends, facing the light-emitting pieces, of the heat conduction pieces stretch into the containing part and are connected with the arc-shaped face; the part, protruding out of the heat dissipation piece, of each heat conduction piece is completely covered with a fluorescent powder layer so that heat generated by the light-emitting piece on the fluorescent powder layer can be transmitted to the arc-shaped face through the heat conduction pieces. The heat generated by the light-emitting part on the fluorescent powder layer is transferred to the cambered surface through the heat conducting part, and the cooling fluid is introduced into the cooling cavity to take away the heat on the cambered surface, so that the comprehensive heat dissipation of the LED light source is realized.

Description

【Technical field】 [0001] The present application relates to the technical field of lithography, and in particular, to an LED light source for direct writing lithography. 【Background technique】 [0002] Lithography is a technique used to print a pattern of features on the surface of a substrate, such substrates may include those used in the manufacture of semiconductor devices, various integrated circuits, flat panel displays (eg, liquid crystal displays), circuit boards, biochips, microchips, etc. Substrates of mechanical electronic chips, optoelectronic circuit chips, etc., the commonly used substrates are semiconductor wafers or glass substrates; in the lithography process, the substrate is placed on the substrate stage, and the exposure device in the lithography equipment is passed through. , project the feature pattern onto the surface of the substrate. The light source is an indispensable component in lithography technology, and the lithography machine is the most crit...

AI Technical Summary

Problems solved by technology

Photolithography machines generally use semiconductor lasers as exposure light sources, but they cannot be used in large quantities on digital lithography machines, especially solder mask digital lithography machines, due to reasons such as high cost, short life, and single wave band. Therefore, in the prior art, often Use LED light sources instead of semiconductor lasers

[0003] After the LED light source is used for a long time, a large amount of heat will be generated in the lithography machine, which will affect the overall performance of the lithography machine. However, the existing method of heat dissipation for the lithography machine is usually to connect a water cooling device to the end surface of the LED light board. The heat dissipation cavity drives the heat dissipation in the lamp panel through the flow of water

However, due to the divergence of the LED light, the heat generated by the LED light in the lithography machine is not concentrated at one point, and the setting of connecting the LED light board through a water cooling device can only drive the flow of heat in a local area of ​​​​the LED light board, and then the heat is emitted by the LED light. Most of the heat is left in the lithography machine, which causes the problem of incomplete heat dissipation

Images