ESD (Electro-Static Discharge) protection circuit structure for high-voltage welding spot density integrated circuit

Abstract

The invention relates to the technical field of integrated circuits, and discloses an ESD (Electro-Static Discharge) protection circuit structure for a high-voltage welding spot density integrated circuit, comprising a substrate, an input end fixedly connected to the outside of the substrate, a circuit module fixedly connected to the outside of the substrate, and a protection module fixedly connected to the outside of the substrate, the exterior of the substrate is fixedly connected with a VDD power line, the exterior of the substrate is fixedly connected with a ground wire, and the exterior of the substrate is fixedly connected with an insulating partition plate; by adopting the protection module composed of the two N-type triodes, the speed of shunting and conducting electrostatic current generated by normal operation of the circuit module to a ground wire can be improved, the reliability of the ESD protection module is improved, and the safety of an integrated circuit is improved.

Description

technical field [0001] The present invention relates to the technical field of integrated circuits, in particular to an ESD protection circuit structure for high-voltage solder joint density integrated circuits. Background technique [0002] An integrated circuit is a miniature electronic device or component that uses a certain process to interconnect components and wirings such as transistors, resistors, capacitors and inductors required in a circuit, and is fabricated on a small or several small semiconductor wafers or On a dielectric substrate, and then encapsulated in a tube case, it becomes a micro-structure with the required circuit functions. The operation of the integrated circuit requires ESD circuit protection. ESD refers to "electrostatic discharge". ESD protection is to prevent electrostatic discharge from causing current to electronic equipment. Thermal effect and electromagnetic effect, the existing ESD circuit adopts a single diode or triode to quickly conduct...

AI Technical Summary

Problems solved by technology

[0003] In order to solve the above-mentioned existing ESD circuit, a single diode or triode cannot be used for fast current shunt conduction protection, which may easily cause damage to the electronic components of the working circuit. At the same time, the solder joint distribution interval of the existing integrated circuit ESD protection circuit is too large, resulting in The ESD protection circuit is too large, which increases the energy consumption and performance of the integrated circuit, and realizes the above-mentioned parallel triode to conduct electrostatic current fast, safe and reliable, physical contact insulation of solder joints, increased solder joint density, reduced integrated circuit volume, and reduced energy consumption. , the purpose of performance increase, the present invention is achieved through the following technical solutions: a kind of ESD protection circuit structure for high voltage solder joint density integrated circuit, comprises substrate, and the exterior of described substrate is fixedly connected with input end, and the exterior of described substrate A circuit module is fixedly connected, a protection module is fixedly connected to the outside of the substrate, a VDD power line is fixedly connected to the outside of the substrate, a ground wire is fixedly connected to the outside of the substrate, and an insulating barrier is fixedly connected to the outside of the substrate. plate

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