Radiation powder material homogenization reaction device

Abstract

The invention is suitable for the field of powder material homogenization reaction devices, and provides a radiation powder material homogenization reaction device which comprises a reaction cavity and further comprises a homogenization assembly arranged in the reaction cavity and connected with a driving assembly. The driving assembly can drive the homogenizing assembly to convey and stir powder in a continuous rotation mode. The upper side of the reaction cavity is communicated with a feeding pipe; a feeding ball valve is arranged on the feeding pipe between the feeding box and the reaction cavity; the lower side of the reaction cavity is communicated with a discharging box through a discharging pipe, and a cambered surface valve assembly and a discharging ball valve are sequentially arranged at the discharging pipe from top to bottom; a heating and heat preservation assembly is arranged in the reaction cavity and used for heating and drying powder. According to the equipment, a reaction technology is combined with stirring, so that materials can react more sufficiently, and meanwhile, the time of material homogenizing and mixing processes on a whole equipment production line is saved due to a homogenizing function.

Description

technical field [0001] The invention belongs to the field of powder material homogenization reaction devices, in particular to a radiation powder material homogenization reaction device. Background technique [0002] The powder material homogenization device is used for the stirring and homogenization of materials in a high temperature and high corrosive environment. The common material homogenization device works well at room temperature or low temperature. [0003] The discharge port of the common material homogenization device is set at the bottom of the material reaction chamber of the device, but this design is defective in the case of high temperature. The material reaction zone requires high temperature, which cannot be solved when the discharge port is set at the bottom. The high temperature resistance of the valve and sealing element at the discharge port, and the material in the reaction chamber needs to stay in the reaction chamber for a long time to ensure suffic...

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Problems solved by technology

[0003] The discharge port of the common material homogenization device is set at the bottom of the material reaction chamber of the device, but this design is flawed under high temperature conditions. The material reaction zone requires high temperature, which cannot be solved when the discharge port is set at the bottom. The high temperature resistance of the valve and sealing components at the discharge p

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