One-dosage-form high-efficiency long-life copper-molybdenum etching solution, and preparation method and application thereof
A long-life, etching solution technology, applied in the field of copper-molybdenum etching solution, can solve the problems of unstable etching performance, poor etching effect, high cost, etc., and achieve the effects of slowing down the etching rate, excellent potential suppression, and economical use cost
Pending Publication Date: 2022-07-29
ZHEJIANG AUFIRST MATERIAL TECH CO LTD
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Problems solved by technology
[0005] The object of the present invention is to propose a one-dose type high-efficiency and long-life copper-molybdenum etching solution, which can be used in In the copper process field involved in the manufacture of TFT-LCD panels, high-efficiency etching can be achieved without additional inhibitors during the etching process, and its stable service life can reach 10,000ppm dissolved copper, and only a very small amount of azoles is added. Inhibitors, which can guarantee extremely reliable etching results
Method used
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Embodiment 1-12
[0042] Embodiments 1-12 disclose a variety of one-form high-efficiency and long-life copper-molybdenum etching solutions, whose components and mass ratios are shown in Table 1:
[0043] Table 1 Examples 1-12
[0044]
[0045]
[0046] The preparation method of the high-efficiency and long-life copper-molybdenum etching solution of one dosage form described in Embodiment 1-12, comprising the following steps:
[0047] Step 1: Weigh the components according to the weight ratio;
[0048] Step 2: Stir and mix ternary inorganic acid, organic acid, dihydrogen phosphate and / or dihydrogen arsenate, organic metal salt, etching inhibitor and deionized water until all materials are completely dissolved;
[0049] Step 3: keep stirring while adding an organic base, the reaction is an exothermic reaction at this time, and the temperature of the solution is heated up;
[0050] Step 4: When the dissolving temperature is lowered to normal temperature, add an oxidizing agent under stirri...
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The invention provides a one-dosage-form efficient long-life copper-molybdenum etching solution and a preparation method and application thereof. The one-dosage form high-efficiency long-life copper-molybdenum etching solution comprises the following components by mass: 5-10 parts of an oxidizing agent; 1-3 parts of ternary inorganic acid; 2-8 parts of organic acid; 4-9 parts of an organic base; 0.1 to 1 part of dihydric phosphate and / or dihydric arsenate; 0.05 to 0.1 part of organic metal salt; 0.001 to 0.005 part of an etching inhibitor; and 70-85 parts of deionized water. The copper-molybdenum etching solution can be applied to the field of copper manufacturing procedures related to TFT-LCD panel manufacturing, efficient etching can be achieved without supplementing an inhibitor in the copper-molybdenum metal layer etching process, the stable service life of the copper-molybdenum etching solution can reach 10000 ppm of dissolved copper amount, and the copper-molybdenum etching solution has the advantages that the copper-molybdenum etching solution can be applied to the field of copper manufacturing procedures related to TFT-LCD panel manufacturing only on the basis of adding a very small amount of an azole inhibitor; therefore, an extremely reliable etching effect can be ensured.
Description
technical field [0001] The invention relates to a copper-molybdenum etching solution technology, in particular to a one-component high-efficiency and long-life copper-molybdenum etching solution, a preparation method and application thereof. Background technique [0002] At present, the TFT-LCD (Thin Flim Transistor-Liquid Crystal Display) display technology has already penetrated into all aspects of people's lives, especially in large-sized displays such as TVs, people have more and more requirements for the size of TVs. For large-scale display devices, most of the source, drain and gate processes are made of copper. This is because copper metal has better electrical conductivity than aluminum metal and is more suitable for the production of high-resolution large-size panels. Due to the active nature of copper atoms, it is easy to diffuse to other film layers, and the adhesion between the copper layer and the glass substrate is poor. Therefore, when making copper wires, it...
Claims
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Login to View More IPC IPC(8): C23F1/18C23F1/26
CPCC23F1/18C23F1/26Y02P70/50
Inventor 侯军滕越其他发明人请求不公开姓名
Owner ZHEJIANG AUFIRST MATERIAL TECH CO LTD