Chip production automatic detection system based on optical CCD module

Abstract

The invention discloses a chip production automatic detection system based on an optical CCD module, which belongs to the technical field of intelligent detection control and comprises an image acquisition module, a signal processing module, a main control module, a display module and an alarm module. According to the invention, IC image acquisition and identification are carried out through the optical CCD module, and the acquisition quality of the IC image is greatly improved by means of the performance of high stability and definition, so that the accuracy of chip anomaly detection is improved; besides, the group comparison logic is adopted to detect whether the placement state of the ICs in the target area is normal or not, the situation that the ICs are damaged in the taking and placing process due to the fact that the ICs are placed abnormally is further prevented, the detection logic carries out frame selection on the ICs placed in a standard mode, a green detection frame of the normal ICs is set, and the detection accuracy of the ICs is improved. And meanwhile, the surface brightness characteristics of the IC placed in the standard are synchronously set as the detection standard, so that the accuracy and the reliability of the IC detection result are improved.

Description

technical field [0001] The invention relates to the technical field of intelligent detection and control, in particular to an automatic detection system for chip production based on an optical CCD module. Background technique [0002] Chip, usually refers to a semiconductor product based on silicon wafer material, also known as integrated circuit and microchip; since its birth in the middle of the twentieth century, chips have been ubiquitous and have been widely used in computers, mobile phones, smart Devices such as terminals and other digital electrical appliances are an important part of the structure of the modern information society; the chip manufacturing process is complex, including: chip design, wafer manufacturing, packaging manufacturing, cost testing and other links, which are implemented in every stage of manufacturing. It may cause defects that affect the function and reliability of the chip; therefore, it is particularly important to conduct real-time inspect...

AI Technical Summary

Problems solved by technology

[0002] Chip, usually refers to a semiconductor product based on silicon wafer materials, also known as integrated circuits, microchips; since its birth in the middle of the twentieth century, chips have been ubiquitous and widely used in computers, mobile phones, smart phones, etc. Devices such as terminals and other digital appliances are an important part of the structure of the modern information society; the chip manufacturing process is complex, including: chip design, chip manufacturing, packaging manufacturing, cost testing and other links, in each stage of manufacturing. It may cause defects that affect the function and reliability of the chip; therefore, it is particularly important to carry out real-time inspection of the chip manufacturing process; nowadays, the chip is mainly picked and placed by the robotic arm in the chip manufacturing process. If the pick and place is abnormal, It is easy to cause direct or indirect damage to the chip; the current CCD technology has been used relatively maturely, and it is widely used in the field of image recognition. Optical CCD can sense optical signals and convert them into electrical signals, with high resolution and resolution Can be changed, has many advantages such as small size, light weight, long life, strong impact resistance, low power consumption, etc., it can automatically identify the color, graphics, characters, etc. of the product, and has a wide range of application scenarios; currently there is no one that can be used for chips The detection system in the production process detects the state of the IC placed in the jig containing the IC in real time, thereby preventing damage caused by the abnormal position of the IC when the robotic arm picks and places it; therefore, how to apply CCD technology to In the process of chip production and manufacturing, real-time detection of its production process, timely detection of abnormal behavior and correction, and reduction of chip damage rate have become the current research focus; for this reason, we propose an automatic chip production detection system based on optical CCD modules

Images