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Multi-frequency megasonic coupling wafer cleaning equipment and multi-frequency spraying device

A technology for cleaning equipment and spraying devices, applied in cleaning methods and utensils, cleaning methods using liquids, sustainable manufacturing/processing, etc., can solve the problems of insufficient impact energy of peeling particles, poor cleaning effect, etc., and achieve high cleaning Efficiency and Particle Removal Rate, Yield Improvement, Effect of High Process Efficiency

Active Publication Date: 2022-08-09
江苏芯梦半导体设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For smaller particles, higher frequency megasonic waves are required, but often the impact energy required to peel off particles cannot be achieved, resulting in poorer cleaning effects

Method used

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  • Multi-frequency megasonic coupling wafer cleaning equipment and multi-frequency spraying device
  • Multi-frequency megasonic coupling wafer cleaning equipment and multi-frequency spraying device
  • Multi-frequency megasonic coupling wafer cleaning equipment and multi-frequency spraying device

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Embodiment Construction

[0042] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art.

[0043] see figure 1 As shown, a multi-frequency megasonic wave coupled wafer cleaning equipment is used for successively cleaning a single wafer 500 in a semiconductor wet process, and is especially suitable for removing the contamination of tiny particles adhering to the surface of the wafer 500 by the megasonic wave technology thing. The cleaning equipment includes a workshop 100 , a first loading table 310 , a second loading stage 320 located on one side of the workshop 100 , a cleaning module 200 and a transmission device 400 and the like located in the workshop 100 .

[0044] In this embodiment, two groups of cleaning modules 200 capable of cleaning the wafers 500 are provided in the workshop 100 at the same time, so...

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Abstract

The invention discloses multi-frequency megasonic coupling wafer cleaning equipment and a multi-frequency spraying device of the multi-frequency megasonic coupling wafer cleaning equipment. The cleaning equipment comprises a cleaning module, the cleaning module comprises a multi-frequency spraying device, the multi-frequency spraying device comprises a first support and a multi-frequency spraying body, the first support is arranged on the workbench, and the multi-frequency spraying body is fixedly arranged on the first support. The multi-frequency spraying main body is provided with at least two spraying parts, each spraying part is provided with a hollow fluid cavity, the different fluid cavities are mutually independent, each spraying part is further provided with a nozzle and a megasonic assembly, each nozzle is communicated with the corresponding fluid cavity, and each nozzle extends in the vertical direction and is located below the corresponding fluid cavity; the axes of the nozzles are gradually converged from top to bottom, and different megasonic assemblies are used for generating megasonic fluids with different frequencies. According to the invention, the coupling of megasonic fluids with various frequencies can be realized, particles with different particle sizes on the surface of the wafer can be removed in one technological process, and the yield of wafer processing is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor wet process technology, in particular to a multi-frequency megasonic wave coupling wafer cleaning equipment and a multi-frequency spray device. Background technique [0002] During various semiconductor manufacturing processes such as lithography, etching, and thin film deposition, particles of different particle sizes adhere to the wafer surface through adhesion. In order to ensure that the size and quantity of particles remaining on the wafer surface can meet the requirements of the process node before proceeding to the next process, special cleaning techniques and methods are required to remove particle contaminants. An important purpose of the wet cleaning process is to effectively remove particle contaminants on the wafer surface and improve the wafer yield without damaging the wafer surface pattern structure. [0003] Megasonic cleaning technology is currently a wafer cleaning technol...

Claims

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Application Information

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IPC IPC(8): B08B3/12B08B3/00B08B3/02H01L21/67
CPCB08B3/02B08B3/12B08B3/003H01L21/67051Y02P70/50
Inventor 廖周芳蒋超伟王泳彬
Owner 江苏芯梦半导体设备有限公司
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