Dustproof method of flexible circuit board MEMS microphone

Abstract

The invention discloses a dustproof method of a flexible circuit board MEMS microphone. According to the method, the first dustproof Mylar film and the second dustproof Mylar film are attached to different work stations in the FPC manufacturing process so that the MIC sound inlet hole can be effectively protected in a sealed mode, the first dustproof Mylar film is attached to the FPC before SMT, the first dustproof Mylar film is attached to the FPC, SMT and rear section manufacturing of the FPC is carried out, the first Mylar film is torn off in the acoustic testing process, testing is carried out, and the testing efficiency is greatly improved. In the FPC manufacturing process, dust prevention measures are taken on the MIC sound inlet hole all the time, the situation that dust and foreign matter enter the MIC sound cavity to cause function failure is effectively avoided, the product quality and yield are improved, meanwhile, the MEMS microphone is subjected to dispensing treatment during SMT, and the production efficiency is improved. According to the method, noise leakage and other defects of the MIC are effectively eradicated, the noise reduction level of the MIC is improved, the method is easy to operate, the dustproof effect is good, the manufacturing cost is low, batch production is facilitated, and the overall use performance of the MIC is improved.

Description

technical field [0001] The invention belongs to the technical field of flexible circuit board production, in particular to a dustproof method for a MEMS microphone of a flexible circuit board. Background technique [0002] The MIC of the mobile phone is the microphone of the mobile phone, which is abbreviated from the microphone. Mobile phone MIC types are usually divided into two types: ECM (Electret Capacitor) microphones and MEMS (Micro Electro-Mechanical Systems) microphones. Traditional ECMs are usually larger in size than MEMS microphones and cannot perform SMT (Surface Mount Technology) operations, while MEMS microphones In the manufacturing process, SMT reflow simplifies the manufacturing process, can omit a manufacturing step that is usually soldered by hand, and also has high acoustic sensitivity. Therefore, in recent years, in mobile phones, tablets / laptops, smart In watches, wearable products, sports cameras and other devices, MEMS microphones are used more and ...

AI Technical Summary

Problems solved by technology

[0004] Usually in consumer electronics products, MEMS microphones are mounted on the surface of FPC (flexible circuit board) through SMT technology. Since the sound inlet of MEMS microphones is open, dust and foreign matter can easily pass through the FPC during the SMT and subsequent manufacturing processes. The sound hole enters the inside of the MIC, causing the film to break or foreign matter on the surface to fail, resulting in the failure of the MIC function. Therefore, the MIC needs to be dust-proof after SMT and before shipment to prevent foreign matter from falling. Generally, the product needs to be turned over During the process or temporary storage, keep the MIC sound inlet facing down at all times to prevent dust and foreign matter from entering the MIC through the sound inlet and causing product failure

[0005] However, this kind of measure requires strict timeliness control, and the dust-proof effect is not good. It cannot completely prevent dust and foreign matter from entering the inside of the MIC. In the actual production process, there is a certain proportion of defects, which leads to product scrapping and a decline in yield.

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