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Lead-free material for spraying gold and its preparing process

A technology of spraying gold material and weight percentage, which is applied in the field of tin-based alloy material preparation, can solve problems such as children's mental decline, lead-containing waste polluting soil and water sources, and death, and achieve improved welding performance, improved contact performance, and improved electrical conductivity. sexual effect

Inactive Publication Date: 2004-10-06
戴国水
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The sprayed metal materials on the end faces of metallized film capacitors that have been widely used are typically lead-based five-element gold-sprayed materials. Zn) 3-6%, antimony (Sb) 0.5-1.5%, bismuth (Bi) 0.1-0.5%, and the rest is lead (Pb). Although the lead-based quinary alloy has good end surface adhesion and excellent welding performance , low melting point, 1KH, 10KH high-frequency test loss angle is small, but its lead content is as high as 53-59.4%, and lead is highly toxic to the human body. Once absorbed by the human body, it will accumulate in the body and cannot be excreted naturally. If the lead concentration in the blood exceeds 10ug / dl, it will cause death. In addition, the accumulation of lead can easily lead to mental decline in children, and lead-containing waste can also pollute soil and water sources

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] Embodiment 1: The composition of each component by weight percentage is: Zn 12-14%, Sb 1.2-1.4%, Cu 0.1-0.3%, and the rest is Sn.

Embodiment 2

[0011] Embodiment 2: The composition of each component by weight percentage is: Zn 15-17% Sb 1.7-1.9% Cu 0.3-0.5% and the rest is Sn.

Embodiment 3

[0012] Embodiment 3: The composition of each component by weight percentage is: Zn 20-22%, Sb 2.2-2.4%, Cu 0.5-0.7%, and the rest is Sn.

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PUM

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Abstract

A Sn-base alloy used for spraying it onto the end face of metallized thin film capacitor contains Zn (12-25 wt.%), Sb (1-3 wt.%), Cu (0.1-1 wt.%) and Sn (the balance). It is prepared through melting Sn and Sb, adding Cu wire, stirring, adding Zn blocks, melting, stirring at 360-380 deg.C for 2 hr, casting, squeezing and drawing. Its advantages are high electric, mechanical and welding performance.

Description

technical field [0001] The invention relates to a lead-free gold-spraying material and a preparation method thereof, and belongs to the technical field of preparation of tin-based alloy materials used for spraying the end faces of metallized film capacitors in electrical discrete devices. Background technique [0002] The sprayed metal materials on the end faces of metallized film capacitors that have been widely used are typically lead-based five-element gold-sprayed materials. Zn) 3-6%, antimony (Sb) 0.5-1.5%, bismuth (Bi) 0.1-0.5%, and the rest is lead (Pb). Although the lead-based quinary alloy has good end surface adhesion and excellent welding performance , low melting point, 1KH, 10KH high-frequency test loss angle is small, but its lead content is as high as 53-59.4%, and lead is highly toxic to the human body. Once absorbed by the human body, it will accumulate in the body and cannot be excreted naturally. If the lead concentration in the bl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/22B23K35/24B23K35/26C22C13/02C23C4/08
Inventor 戴国水
Owner 戴国水