Liquefied dicyandiamide and its preparing process

A technology of dicyandiamide and chemical formula, applied in the field of liquefied dicyandiamide and its preparation, can solve the problems of poor miscibility of epoxy resins and complicated processes, and achieve long-term storage stability and good compatibility.
CN1194025CInactive Publication Date: 2005-03-23北京科化新材料科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
北京科化新材料科技有限公司
Publication Date
2005-03-23
Estimated Expiration
Not applicable · inactive patent

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Abstract

Liquefacient dicyandiamide and its preparation method. The method comprises: adding 100 parts of dicyandiamide, 300-600 parts of dehydrated neodecanoic acid glyceride, 50-200 parts of solvent, 0.5-1 par of 2-ethyl-4-methylimidazol or 2-methylimidazol into a reactor; mixing and heating, reacting for 12-14hours at 140degree C-150degree C ; vacuumizing and removing the solvent, obtaining viscous liquid. When the liquefacient dicyandiamide is used with ethoxyline resin, the weight ratio of liquefacient dicyandiamide to ethoxyline resin is 30-50:100. Liquefacient dicyandiamide of the invention could be dissolved in ethoxyline resin, has an ability of solidifying ethoxyline resin with high mechanical strength.
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Description

technical field

[0001] The invention belongs to the field of coatings, composite materials or adhesives, and in particular relates to liquefied dicyandiamide and a preparation method thereof. Background technique

[0002] Dicyandiamide is also known as cyanoguanidine. First, due to the effect of conjugated double bonds and cyano groups in the molecule, the alkalinity is greatly reduced, so its mixture with epoxy resin is very stable at room temperature and can be used as a latent curing agent; second, it is compatible with epoxy resin The cured product has excellent mechanical properties; third, it is non-toxic and non-irritating. Therefore, as a curing agent for epoxy resins, dicyandiamide is widely used in the fields of coatings, composite materials, and adhesives.

[0003] Dicyandiamide is a white crystalline powder with a melting point of 207-209°C. Soluble in water and ethanol, but poor miscibility with epoxy resin, so dicyandiamide, as an effec...

Claims

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