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Method for packaging electroluminescence element

A technology of electroluminescent components and packaging methods, which is applied in the direction of electroluminescent light sources, electrical components, electric light sources, etc., can solve the problems of reduced production efficiency, air bubbles between epoxy resin and glass cover plate, and increased production costs, so as to reduce Production cost, improvement of production efficiency and product qualification rate, and the effect of preventing performance degradation

Inactive Publication Date: 2005-05-04
DELTA OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, the above-mentioned encapsulation method has a relatively good encapsulation effect on the entire surface of the organic electroluminescent diode coated with epoxy resin, but the uniformity of the epoxy resin is difficult to control when the entire surface is coated with epoxy resin. Difficulties in mass production
In addition, when the glass substrate and the glass cover or the metal cover are pressed together, it is easy to cause glue overflow on the entire surface of the component, causing the circuit connecting the light-emitting component and other external components to be covered by the glue, resulting in the light-emitting component being unable to work normally after packaging , resulting in reduced production efficiency, poor product pass rate, and increased production costs
Moreover, when covering the glass cover, it is easy to generate air bubbles between the epoxy resin and the glass cover, which will still cause adverse effects on the light-emitting element.

Method used

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  • Method for packaging electroluminescence element
  • Method for packaging electroluminescence element
  • Method for packaging electroluminescence element

Examples

Experimental program
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no. 1 example

[0049] Please refer to Figure 4 , is a flow chart of a packaging method for electroluminescent elements according to the first embodiment of the present invention. Figure 5A to Figure 5H , is a schematic diagram of the manufacturing process of a packaging method for electroluminescent elements according to the first embodiment of the present invention. and Figure 4 Steps 400-414 in the Figure 5A to Figure 5H Corresponding.

[0050] like Figure 4 shown in step 400 in , and please refer to Figure 5A , firstly in an environment 530 where water vapor and oxygen concentration are controlled, for example, in an environment where water and oxygen concentration are less than one part per million (1ppm), such a controlled environment includes a glove box (Dry Box), etc., and then provides There is a glass substrate 500 with an electroluminescent element 502 and a glass cover 504 corresponding to the glass substrate 500, and a sealant 508 is coated on a frame position 506 on ...

no. 2 example

[0060] The packaging method of the electroluminescent element proposed by the present invention can also be applied to the packaging of large-area electroluminescent elements. Please refer to Figure 7 , is a flow chart of a packaging method for a large-area electroluminescent element according to the second embodiment of the present invention. Figure 8A to Figure 8F , is a schematic diagram of the manufacturing process of a packaging method for a large-area electroluminescent element according to the second embodiment of the present invention. Similar to the first embodiment, Figure 7 Steps 700-710 in the Figure 8A to Figure 8F Corresponding.

[0061] like Figure 7 shown in step 700 in the Figure 8A , same as the first embodiment, under the environment 830 where the concentration of moisture and oxygen is controlled, a glass substrate 800 and a corresponding glass cover 804 are provided, and a single large-area electroluminescent element 802 is provided on the glass...

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Abstract

Under the environment of controlling water and oxygen, the glass base plate and the relevant glass cover board possessing the electro photoluminescent components are provided. The frame glue is gelatinized on the cover board where is relevant to the frame place of each light-emitting component on the base plate. The opening is preassigned on the side where there is no circuit on the peripheral ofthe light-emitting component. The cover board and the base plate are pressed together and the frame glue is solidifed. Then, each light-emitting component is separated through cutting so as to form the single piece to be packed. The pieces to be packed are put into the vacuum cavity. With the pressure being reached to the preset value, the said pieces are immerged into the glue trough.

Description

technical field [0001] The present invention relates to a packaging method for electro-luminescent (Electro-Luminescent, EL) components, and in particular to a packaging method for organic electro-luminescent (Organic Electro-Luminescent, OEL) components. Background technique [0002] The research and development of organic electroluminescence began in the 1960s. Organic electroluminescence elements use organic compounds as materials for the light-emitting layer, which are sandwiched between the upper metal electrode and the lower transparent anode. According to the types of organic materials, they can be divided into small molecule light-emitting diodes (Organic Light-Emitting Diode, OLED) and polymer light-emitting diodes (Polymer Light-Emitting Diode, PLED). In the early 1980s, Kodak of the United States used Tri-(8-Hydroxyquinoline) Aluminum (Tri-(8-Hydroxyquinoline) Aluminum, Alq 3 ) as the organic light-emitting layer, and a hole injection layer (Hole Injecting Layer)...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L33/00H01S5/00H05B33/10
Inventor 白瑞芬陈永成周宜衡
Owner DELTA OPTOELECTRONICS