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Micro bridge resonator temp ecompensation structure

A temperature compensation and resonator technology, applied in the field of micro-electronic mechanical systems, can solve the problems of the influence of the distance between the temperature measuring element and the bridge resonator, the long response time, and the difficulty of increasing the chip manufacturing process.

Inactive Publication Date: 2005-05-25
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, commercial temperature sensors (such as thermocouples, thermal resistors, bimetal temperature sensors, etc.) are large in size and have a long response time, and it is difficult to ensure that the bridge resonator responds synchronously to temperature changes.
In addition, when the temperature field is not uniform, the distance between the temperature measuring element and the bridge resonator will also have a certain impact on the measurement
Although the thin-film temperature sensor and the bridge resonator can be integrated on the same chip, the thermal conductivity conditions of the thin-film resistor and the bridge resonator are different, and their response rates to temperature must be different, which will inevitably lead to faster temperature changes in some cases. large error; in addition, it also increases the difficulty of the chip manufacturing process

Method used

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  • Micro bridge resonator temp ecompensation structure
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  • Micro bridge resonator temp ecompensation structure

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Embodiment

[0023] Example: see figure 1 , figure 2 The present invention includes microbridge resonator 1, microcantilever beam resonator 2, substrate 3, lead 4, preamplifier 9 and 14, bandpass filter 10 and 15, phase shifter 11 and 16, automatic gain amplifier 12 and 17, adders 13 and 18, constant voltage source 19 and data processing unit 20.

[0024] The micro-bridge resonator 1 for electrothermal excitation / pressure-sensitive bridge pickup vibration and the micro-cantilever beam resonator 2 as a temperature sensor are fabricated on the same chip through microelectronic technology and micromachining technology. The micro-bridge resonator 1 and the micro-cantilever beam resonator 2 have the same material, the same or similar thickness, and the same manufacturing process. The temperature sensor 2 is manufactured while the micro-bridge resonator 1 is manufactured.

[0025] An excitation resistor 5 is made in the middle of the micro-bridge resonator 1 to excite the vibration of the mic...

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Abstract

The invention discloses a frequency output composite micro-beam resonator with temperature self-compensation function. The resonator is composed of a micro-bridge resonator and a micro-cantilever beam resonator fabricated on the same chip. The beam resonators have the same material, equal or similar thickness, and the same manufacturing process and are manufactured at the same time, so they can respond to temperature changes synchronously; the distance between the micro-bridge resonator and the micro-cantilever beam resonator is on the order of microns, so the temperature-sensitive element can be accurately Reflects the temperature of the microbridge resonator. Through data fusion technology, the resonant frequency of the micro-cantilever beam resonator as a temperature-sensitive element can compensate the cross-sensitivity of the temperature change to the resonant frequency of the micro-bridge resonator in real time, thereby reducing the temperature coefficient of the resonant frequency of the micro-bridge resonator and improving the resonator. range of working temperature.

Description

technical field [0001] The invention belongs to the field of micro-electro-mechanical systems (MEMS), and relates to a temperature compensation structure of a micro-mechanical bridge resonator. Background technique [0002] The microresonant sensor with mechanical resonance frequency manufactured based on silicon micromachining technology is a very important type of sensor. This type of microsensor has the advantages of quasi-digital signal output, strong anti-interference ability, low production cost, low power consumption, small size and light weight. Micro-resonant sensors use the vibration frequency, phase and vibration amplitude of resonant elements such as micro-cantilever beams, micro-bridges (double-end fixed beams) and square membranes as sensitive quantities to measure various physical quantities, such as pressure, vacuum, and angular velocity. , acceleration, flow rate, temperature, humidity and gas composition, etc. [0003] Compared with micro-cantilever beam ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B3/00H01L49/00H03H9/00
Inventor 朱长纯韩建强刘君华
Owner XI AN JIAOTONG UNIV
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