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Electric conductive paste and external electrodes and manufacture thereof

A technology of conductive paste and external electrodes, applied in the direction of conductive adhesives, conductive coatings, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problem of internal electrode melting, peeling, and failure to obtain electrodes, components, and substrates. connection strength etc.

Inactive Publication Date: 2005-06-22
TDK CORPARATION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, when a glass frit that does not contain lead oxide is used, the bonding strength between the electrode and the element or substrate cannot be obtained, and the electrode tends to be peeled off from the element, substrate, etc.
When the firing temperature of the conductive paste is increased, although this problem can be solved, the melting of the internal electrodes occurs as described above.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-4

[0040] Embodiment 1-4, comparative example 1-2

[0041] Glass frits were produced with the compositions shown in Table 1. However, the glass frit of Comparative Example 1 has a composition outside the scope of the present invention, and the glass frit of Comparative Example 2 is a conventional glass frit containing lead oxide as a main component.

[0042] Composition (%)

Example

comparative example

1

2

3

4

1

2

BaO

35

35

35

35

55

-

ZnO

15

10

10

10

10

-

B 2 o 3

10

10

10

10

10

10

SiO 2

30

32

22

30

15

30

Al 2 o 3

5

5

5

5

5

-

Na 2 o

5

5

5

5

5

-

ZrO 2

-

3 ...

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PUM

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Abstract

An electrically conductive paste in which the glass frit contained is substantially free of lead oxide and contains B 2 o 3 : 5.0-30.0 wt%, SiO 2 : 10.0-60.0% by weight, BaO: 45.0% by weight or less, ZnO: 20.0% by weight or less, Al 2 o 3 : 12.0% by weight or less, and Na 2 O: 15.0% by weight or less. The method of manufacturing the external electrodes includes the step of firing the conductive paste at 500-750°C. This method uses a glass frit substantially free of lead oxide, and can be fired at a low temperature. And an external electrode with sufficient adhesive strength can be obtained.

Description

technical field [0001] The present invention relates to a conductive paste suitable for forming external electrodes of electronic components, and more specifically, to a conductive paste containing substantially no environmentally harmful lead compounds in glass frit contained therein. Furthermore, the present invention also provides an external electrode of an electronic component obtained by firing the above-mentioned conductive paste, a method for producing the same, and an electronic component having the external electrode. Background technique [0002] In electronic components and multilayer electronic components that use magnetic materials or dielectric materials as elements, a conductive paste is printed or applied as terminal electrodes of the components or external electrodes provided on surface patterns constituting circuits, etc., It is made by drying, that is, after removing the solvent, and then firing. In addition, in order to maintain the adhesive strength be...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/24C03C3/066C03C8/02C03C8/04C03C8/14C03C8/18H01B1/20H01B1/22H01G4/12
CPCC03C8/02C03C8/04C03C8/18H01B1/22H01B1/24
Inventor 佐藤稔吉村浩喜小林健儿服部修
Owner TDK CORPARATION