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Structure of reducing mutual inductance between adjacent wires on substrate

A technology for substrates and wires is applied in the structural field that can effectively reduce the mutual inductance between adjacent wires on the substrate, and can solve the problems of serious mutual inductance effects of transmission lines and inability to effectively reduce the mutual inductance effects of transmission lines.

Inactive Publication Date: 2005-08-03
VIA TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] The parallel wiring method for transmission lines cannot effectively reduce the mutual inductance effect between transmission lines
Especially at present, the clock frequency used by the CPU is as high as hundreds of MHz, and the wiring of the motherboard circuit will make the mutual inductance effect between the transmission lines more serious.

Method used

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  • Structure of reducing mutual inductance between adjacent wires on substrate
  • Structure of reducing mutual inductance between adjacent wires on substrate
  • Structure of reducing mutual inductance between adjacent wires on substrate

Examples

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Embodiment 1

[0030] Please refer to figure 2 , is a type of hollow transmission line with a structure that reduces the mutual inductance between adjacent wires on the substrate of the present invention. The configuration of transmission line 21,23 is as figure 1 The transmission lines 11, 13, while figure 1 The transmission line 12 is replaced by a rectangular hollow transmission line 22 with a hollow shape, and a vertex a or b of the hollow transmission line 22 is coupled to a printed circuit board or a ball grid array package for use as a signal input point; the other vertex of the hollow transmission line 22 b or a is coupled to a printed circuit board or a ball grid array package and used as a signal output point. At the same time, in order to prevent the antenna radiation effect generated at high frequency, a plurality of vertices c and d of the hollow transmission line 22 coupled to the printed circuit board or outside the ball grid array package are beveled. In addition, the len...

Embodiment 2

[0045] Please refer to image 3 , is another type diagram of a hollow transmission line with a structure that reduces the mutual inductance between adjacent wires on the substrate of the present invention. figure 2 The hollow transmission line 22 in is the rectangle of hollow form, and image 3 Another type of hollow transmission line 22 is then provided, which is also a hollow rectangle, except that the long sides ac and bd protrude slightly from the short sides ad and bc for a certain length. Wherein a vertex a or b of the hollow transmission line 22 is coupled to a printed circuit board or a ball grid array package as a signal input point, and the other vertex b or a of the hollow transmission line 22 is coupled to a printed circuit board or a ball grid array package , used as a signal output point. At the same time, in order to prevent the antenna radiation effect generated at high frequency, a plurality of vertices c and d of the hollow transmission line 22 coupled to ...

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Abstract

The present invention is a structure to lower the mutual inductance between the adjacent conducting wires on the base plate, it lays a hollow transmitting wire in between the complex numbers of transmitting wires disposed in parallel. Two top points of the hollow transmitting wire are coupled with bondwire and the via of printed circuit board or ball grid array board separately to be used as signal input and output points at the same time the complex numbers of top points of the hollow transmitting wire coupled with the printed circuit board or ball grid array board are bevelled jointed, and setting the length of complex short-edges as half of transmitting signal wave length so that the signal phase on two long-edges are completely reversed in phase to nearly eliminate all the mutual inductance and to effectively lower the cross-linking effects.

Description

technical field [0001] The invention relates to a structure between printed circuit boards or ball grid array boards, and in particular to a structure that can effectively reduce the mutual inductance between adjacent wires on the substrate. Background technique [0002] Since IBM developed PC / XT and later PC / AT personal computers, many manufacturers have followed suit to manufacture personal computers compatible with IBM PC, making such computers widely used all over the world. [0003] From the development of IBM PC until now, although hardware and software technology have made great progress during this period, the motherboard configuration of these commonly used personal computers still follows the original form, which is generally called AT motherboard in the industry. Due to the advancement of hardware, the area of ​​the motherboard can be reduced, and the volume of the entire computer is also reduced. The industry generally refers to the reduced personal computer as a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/48H05K1/00H05K9/00
CPCH01L2924/0002
Inventor 李春和
Owner VIA TECH INC
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