Integrated heat dissipation device

Abstract

An integrated heat-disspetation device to be used for display chip and internal stroage chip on the display card consists of a flat sheet with a first plane and a second plane opposite to the first one. The first plane has mutiple first fins and multiple second fins with the first ones vertical to the first plane and the second ones having an included angle degree of any angle degree except 90 degree to the first plane. The second plane contacts both of display chip and internal storage chip. The flat sheet has a clasper at its one edge to hold end edge of display card and there is a fan located in the first plane. This invention integrates the heat-dissipation devices for display chip and internal storage chip separately into one device, and a clasper is added for antidropping by vibration.

Description

technical field [0001] The present invention relates to an integrated heat dissipation device, and in particular to an integrated heat dissipation device applied to a display chip and a memory chip on a display card. Background technique [0002] In a computer system, the display card acts as the data display interface between the human and the computer interface. Many important information and application functions must be helped by the display card and the screen, so that the computer can exert powerful functions and help people solve problems. . The requirements of computer users for display cards have progressed from the earliest monochrome display cards to the current 3D graphics acceleration display cards, which means that the main driving force of technological progress comes from demand, because users have different needs, and different technologies are derived. display card. Looking back at the development process of the display card, with the increasingly intensi...

AI Technical Summary

Problems solved by technology

[0005] Because the second heat sink 300 does not have a fastening device, it needs to be glued on the display memory 120 with a two-in-one heat conduction adhesive as an adhesive, but this heat conduction adhesive requires a long curing time and needs to be first The assembly of the main radiator 200 can only be done after the second radiator 300 is installed, so the assembly of the entire radiator requires multiple processes, which is quite time-consuming and labor-intensive

Furthermore, because the display card 100 has the problem of board bending, if the thickness of the heat-conducting adhesive on the part of the second heat sink 300 is not enough, the second heat sink 300 will easily fall due to the vibration during transportation.

Moreover, there is no cooling fin on the second heat sink 300, the overall surface area is small, and it is not connected with the main heat sink 200, so the heat on it cannot be directly conducted to the main heat sink 200, so its cooling effect is relatively low. Difference

And because the heat dissipation fins 210 on the main heat sink 200 are all upright, the area that it can provide heat dissipation is small, also affects its heat dissipation efficiency

[0006] To sum up, the general heat sink has the problems of inconvenient processing and the heat sink is easy to fall off, and the heat dissipation of this combined heat dissipation system on the display memory will be relatively poor

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