Production method of film circuit plate

A thin-film circuit board and circuit technology, which is applied in the manufacture of printed circuits, printed circuits, electrical components, etc., can solve problems such as inconvenience for users, poor product reliability, and many printing processes.
CN1247056CInactive Publication Date: 2006-03-22ZIPPY TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
ZIPPY TECH
Publication Date
2006-03-22
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention relates to a method for making film circuit board. Under the condition of having no wire jumper and preventing production of unknown key signal it adopts the following steps: making key position circuit and matrix arrangement, then when the film circuit board is made, firstly making PET heating preshrinking process of film circuit board, then printing circuit silver slurry on the film circuit board, then printing insulating layer or printing carbon layer on the printed circuit silver slurry, folding the film circuit board and making ultrasonic combination, punching structure holes on the film circuit board so as to obtain the product.
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Description

technical field

[0001] The invention relates to a manufacturing method of a thin-film circuit board, in particular to a method for arranging a key position circuit and matrix (Matrix) without jumping wires and avoiding the generation of unknown key signals, and then performing thin film according to the arranged key position and matrix. Method for making circuit boards. Background technique

[0002] It is known that the keyboards used in notebook computers currently on the market also include a thin film circuit board (Membrane) in addition to the upper keys, the substrate, and the bridging bridge. When making this thin film circuit board, the manufacturer will first define and shape the button position layout, and then hand over the defined and shaped button position layout to the manufacturer for the matrix arrangement of the buttons (such as figure 1 shown), after the matrix arrangement of key positions, fill in the position code of each key in the chip.

[0003] After ...

Claims

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