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Photosensitive ceramic blank plate, ceramic package and process for producing same

A manufacturing method and photosensitivity technology, applied in electrical components, printed circuits, etc., can solve the problems of pattern peeling, photosensitivity and resolution, high precision, etc.

Inactive Publication Date: 2006-04-12
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still many problems in the actual transfer method, such as aligning the patterned film with the plate and substrate before transfer, the shape stability of the film, and the peelability of the pattern, etc.
In addition, the photosensitive paste has low sensitivity and resolution, and high precision cannot be obtained, which is the same as the usual photolithography method.

Method used

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  • Photosensitive ceramic blank plate, ceramic package and process for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0267] The plate thickness was 100 μm, exposure was performed from one side, and shower image development was performed at 30°C. Patterning is to spread the paste all over the ceramic blank and fill the via holes with conductors at the same time.

[0268] Good via hole shape was obtained after firing.

Embodiment 2

[0270] The thickness of the plate is 200 μm, one-sided exposure is performed sequentially from both sides, and spray development is performed at 30°C. The paste is applied to the entire surface of the ceramic blank, and at the same time, the conductor filling of the via hole is performed to form a pattern.

[0271] A good via hole shape was also obtained after firing.

Embodiment 3

[0273] The thickness of the plate is 200 μm, both sides are exposed at the same time, and are developed by spraying at 30°C. Spread the paste on the film to form a via hole and then transfer it to a ceramic blank to form a pattern. As the transfer film, a polyester film with a peel strength of 5N / 24mm was used.

[0274] A good via hole shape was also obtained after firing.

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Abstract

A photosensitive ceramic blank sheet containing inorganic powder and photosensitive organic component as the essential ingredients, wherein the average refractive index N1 of the organic component and the average refractive index N2 of the inorganic powder hold at that N2-N1 is not more than 0.2 and not less than -0.05, and a ceramic package having high aspect ratio and high precision produced from blank sheet.

Description

field of invention [0001] The present invention relates to a new photosensitive ceramic blank, a method for forming a via hole on a ceramic blank, a method for forming a circuit wiring pattern on a ceramic blank, and a ceramic assembly . [0002] The photosensitive ceramic base plate of the present invention can be used for ceramic fired substrates for high-density mounting of semiconductor elements, especially multilayer ceramic fired substrates, and can form fine circuit patterns of surface layers and inner layer electrodes on the surface of the substrate. Effectively photosensitive ceramic blanks. Background of the invention [0003] In recent years, computers and communication equipment have been continuously developed towards miniaturization and high performance. Along with this development trend, it is required to improve the formation of via holes and through holes (hereinafter referred to as via holes) on ceramic substrates for mounting semiconductor elements. as a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/00H05K1/00
Inventor 尾形如彦正木孝树井口雄一朗田中刚岩永庆二
Owner TORAY IND INC
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