Extruded core laminates for circuit boards

A core board and circuit technology, applied in the direction of circuit substrate materials, printed circuits, printed circuits, etc., can solve problems such as safety and environment, high cost reduction, etc.

Inactive Publication Date: 2000-08-02
ISOLA LAMINATE SYST CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the dimensional stability of this laminate is improved, the high cost of producing this laminate reduces its viability
The use of organic solvents in the manufacture of laminates in this patent and the use of other laminates pose safety and environmental concerns

Method used

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  • Extruded core laminates for circuit boards
  • Extruded core laminates for circuit boards
  • Extruded core laminates for circuit boards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0036] Standard process for producing b-grade core panels

[0037] The system for efficient continuous production of b-stage extruded laminated core panels consists of a Leistritz 34 mm co-rotating twin-screw extruder with screw elements configured as shown in Figure 2, including take-up rolls and a b-grade curing furnace. The twin-screw extruder was equipped with the following components: 1) a weight loss feeder (Ktron, K 2LDS-T20) for weighing cullet (chopped glass); 2) a calibrated screw feeder (Ktron, T20-87 -035-F1, with separate feed screw capable of delivering microspheres); 3) an injection unit and catalyst reservoir connected to a pump, both located in a temperature-controlled box; 4) an injection unit connected to a pump and epoxy resin storage tanks, both located in a temperature-controlled box, and a mold for sheet molding.

[0038] Raw materials for the production of extrusion laminated core panels include chopped E-glass (length 3 / 16 inch, Certainteed), glass h...

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Abstract

A method for fabrication of a circuit board laminate (10) in a continuous process employs an extruded laminate core (12). Streams of a fibrous material, microspheres or fused silica, a catalyst and a thermosetting resin are added to an extruder and the core extruded as a film; outer layers (18, 19) can be applied to the extruded core.

Description

[0001] This application claims priority from Provisional Patent Application 60 / 045387, filed May 2,1997. Background of the invention [0002] Circuit boards for current circulation generally comprise a multilayer composite material consisting of laminates comprising a thermosetting polymer and a suitable reinforcing substance. Typically, the reinforcing substance is a woven glass material, such as glass fibres. Thermosetting polymers are epoxy resins. A limitation that must be considered when producing multilayer composites is the reduced dimensional stability of the laminate, especially in response to temperature. Thermal cycling during circuit board operation can cause expansion and contraction of the laminate, resulting in loss of the required bond or corresponding connection between inner layers. Since the effective function of an electronic device depends on the correct positioning of these interconnection layers, incorrect positioning of the interconnection layers can ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29B11/16B29B13/02B29C47/00B29K105/06B32B5/28B32B27/06B32B37/15H05K1/03H05K3/02H05K3/46
CPCB32B2305/74H05K3/022H05K1/0373B32B2307/204H05K2201/0209B32B2038/0076B32B2309/10B32B37/153B32B2457/08H05K2201/0251B32B2311/12B32B2305/30H05K2201/0254B32B27/06B32B2262/101B32B2260/021B32B15/092B32B27/12B32B27/38
Inventor 弗雷德·J·吉弗里弗兰克·梅尔斯杰弗里·D·普拉特拉里·D·奥尔森
Owner ISOLA LAMINATE SYST CORP
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