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Holding device for treated body

A technology for objects to be processed and holding devices, which is applied to holding devices, positioning devices, and electric solid devices using electrostatic attraction, and can solve problems such as increased costs and complex structures

Inactive Publication Date: 2006-06-28
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this mechanical device has a complex structure due to the engaging and disengaging connection device of the driving device and the clamping member, which becomes the main cause of cost increase.

Method used

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  • Holding device for treated body
  • Holding device for treated body
  • Holding device for treated body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0024] figure 1 It is a cross-sectional view of a configuration example of the object holding device according to the first embodiment of the present invention.

[0025] The object holding device 10 is composed of a convex base body 1 , a first dielectric film 14 a , a second dielectric film 14 b and a focus ring 12 . A semiconductor wafer (hereinafter referred to as a wafer) W as an object to be processed is transported and placed on the susceptor body 1 by a transport device not shown in the figure. The first dielectric film 14 a covers the wafer mounting surface (holding portion) 11 a on the boss surface of the susceptor body 1 . The second dielectric film 14b covers the focus ring mounting surface (flange) 11b of the boss outer peripheral edge portion of the base body 1 and the side wall surface 11c of the boss. The focus ring 12 then engages in the fla...

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Abstract

An apparatus for holding an object to be processed, according to this invention includes a convex-shaped holder main body, first dielectric film, and second dielectric film. The holder main body has a holding portion which holds an object to be processed placed on it and a flange formed on the peripheral portion of the holding portion to fit with a focus ring. The first dielectric film attracts the object to be processed placed on the holding portion to the holder main body by a Coulomb force. The second dielectric film attracts the focus ring fitted on the flange to the holder main body by an attracting force larger than that of the first dielectric film using a Johnson-Rahbek force. The electrostatic attracting force of the focus ring for the holder main body is increased, so that the cooling effect is increased. A change in plasma processing characteristics over time in the vicinity of the focus ring can be eliminated, and the entire surface of the object to be processed can be processed uniformly.

Description

technical field [0001] The present invention relates to a processing target holding device which is placed in a processing chamber of a plasma processing device or the like to hold a processed object. Background technique [0002] Generally, as an apparatus for performing plasma processing on a substrate to be processed such as a semiconductor wafer, a CVD apparatus, an etching apparatus, etc., an ashing apparatus for removing a resist mask, etc. are well known. [0003] This plasma processing apparatus has a processing chamber for generating plasma in an atmosphere in which a processing gas is introduced, and processing a loaded substrate to be processed. In the processing chamber (processing chamber), a device for generating plasma The electrode function and the holding device for holding the object to be treated. [0004] Fig. 5 shows a configuration example of a conventional holding device. [0005] The holding device consists of a mounting table (base body) 1 on which...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/68H01L21/205H01L21/302B23Q3/15C23C16/458H01L21/3065H01L21/60H01L21/683H02N13/00
CPCH01L21/6835C23C16/4585H01L21/6831H01L21/6833H01L24/90H01L2924/01004H01L2924/01013H01L2924/01023H01L2924/01033H01L2924/01074H01L2924/01078H01L2924/01082
Inventor 舆石公桧森慎司
Owner TOKYO ELECTRON LTD
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