Manufacturing method of flash storage having separated floating grid and its structure
A manufacturing method and separate technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of the continuous improvement of the integration degree of memory devices, and achieve the effect of improving the integration degree and increasing the storage capacity.
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[0023] The manufacturing method of the flash memory with split floating gate in the preferred embodiment of the present invention is as follows Figure 2A to Figure 2G shown.
[0024] First, please refer to Figure 2A A substrate 200 is provided, and an oxide layer 202 is formed on the substrate 200, wherein the material of the oxide layer 202 is, for example, silicon oxide, and the method for forming the oxide layer 202 is, for example, a thermal oxidation method. Next, a patterned sacrificial layer 204 is formed on the oxide layer, wherein the material of the sacrificial layer 204 is, for example, silicon nitride. The method of forming the sacrificial layer 204 is, for example, to form a material layer (not shown) on the oxide layer 202 , and then form a patterned sacrificial layer 204 by means of lithographic etching.
[0025] Next, please refer to Figure 2B , forming the source 206 and the drain 208 in the substrate 200, wherein the method of forming the source 206 and...
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