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Tin-zinc-aluminium alloy wire

A technology of aluminum alloy wire and tin-zinc, which is applied in the field of tin-zinc-aluminum alloy wire, can solve the problems of complicated process, increased process, increased cost, etc., and achieve the effect of improving electrical contact performance and enhancing bonding fastness

Inactive Publication Date: 2006-09-20
ZHEJIANG WUFENG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The sprayed metal material (referred to as gold spray material) on the end face of metallized film capacitors that has been widely used, typically such as lead-based five-element gold spray material, because it contains about 55% lead, and lead is a kind that has a strong effect on the human body. Toxic substances have been gradually eliminated in the global wave of lead-free electronic components. A considerable number of manufacturers are replacing lead-based five-component gold-sprayed materials with tin-zinc alloys, because tin-zinc alloys are compatible with lead-based five-component Elemental gold-sprayed material also has good end surface adhesion and superior welding performance, and at the same time has a low melting point. The original equipment using lead-based five-component gold-sprayed material includes process parameters, and it can be used to spray tin-zinc without much modification. Alloy wire, but in order to ensure good contact between the sprayed layer and the thin film evaporation layer, it is often necessary to spray a layer of pure zinc bottom layer first, and then spray the tin-zinc alloy surface layer to meet the process requirements of capacitor production, which increases the process and makes The process is complicated and indirectly increases the cost

Method used

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Examples

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Embodiment

[0016] Example: Sn 50 Zn 48 Al 2 The tin-zinc-aluminum alloy wire has the following components by weight percent: tin (Sn) 50%, aluminum (Al) 2%, the rest zinc (Zn) and impurities not greater than 0.1%.

[0017] Comparative example of prior art: Sn 50 Zn 50 The tin-zinc alloy wire has the following components by weight percent: tin (Sn) 50%, the rest is zinc (Zn) and the total amount of impurities is not more than 0.1%.

[0018]

[0019] The actual trial of the tin-zinc-aluminum alloy wire of the present invention proves that the use of the tin-zinc-aluminum alloy wire of the present invention for spraying the end face of a metallized film capacitor can be done successfully at one time, and it is not necessary to spray the zinc bottom layer first, which greatly simplifies the gold spraying operation process .

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Abstract

An alloy silk contains Sn, Zn and Al, the weight percentage of each component is: Sn 40-60%, Al 1-3%, rest are Zn and impurities not greater than 0.1%, the priority is Sn 49-51%, Al 1.5%-2.5%. This invention adds Al element on the current SnZn alloy silk to increase the bond toughness of film evaporated layer and improved the electric contact performance, reduce melting point and stabilize the entire spray layer.

Description

technical field [0001] The invention relates to a tin-zinc-aluminum alloy wire, which belongs to the technical field of spray coating materials for the end faces of metallized film capacitors in electrical discrete devices. Background technique [0002] The sprayed metal material (referred to as gold spray material) on the end face of metallized film capacitors that has been widely used, typically such as lead-based five-element gold spray material, because it contains about 55% lead, and lead is a kind that has a strong effect on the human body. Toxic substances have been gradually eliminated in the global wave of lead-free electronic components. A considerable number of manufacturers are replacing lead-based five-component gold-sprayed materials with tin-zinc alloys, because tin-zinc alloys are compatible with lead-based five-component Elemental gold-sprayed material also has good end surface adhesion and superior welding performance, and at the same ti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B5/00H01G4/008H01G4/228
Inventor 戴国水金成焕
Owner ZHEJIANG WUFENG ELECTRONICS