Thin ceramic film preparation method
A technology of ceramic membrane and ceramic membrane, which is applied in the field of preparation of ceramic wafers, can solve the problems of complex process, high cost, and the inability of thin ceramic membranes to achieve high mechanical strength, and achieve simple manufacturing process, high mechanical strength, and save sintering the effect of time
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specific Embodiment approach 1
[0007] Specific embodiment one: this specific embodiment is illustrated in conjunction with Fig. 1, and the steps of this specific embodiment include: 1. Assemble the mould: put briquetting 2 in mold 1; Nanoscale particle size buffer material, then insert the mold plug 3 in the mold 1, press gently, and flatten the buffer material to form a buffer layer 4; 3. Add ceramic powder: ceramic powder with micron particle size Sprinkle evenly on the top of the buffer layer 4 to form a diaphragm powder layer 5, wherein the quality of the micron-sized ceramic powder per square centimeter on the cross section of the mold 1 is 10 mg to 100 mg; 4. Dry pressing: Use a tablet press at a pressure of 10-800 MPa to pressurize the diaphragm powder layer 5 for 0.1-10 minutes to form a ceramic membrane blank 6; 5. Demoulding: when the ceramic membrane blank 6 is taken out from the mold 1, use the ceramic membrane blank 6 The difference in the expansion of the buffer layer 4 in the demoulding proce...
specific Embodiment approach 2
[0008] Embodiment 2: In Embodiment 1, the ceramic powder of the micron-sized particle size in the ceramic powder added in step 3 is one of the micron-sized powder of yttria-stabilized zirconia and the micron-sized ceramic powder of aluminum oxide kind. The method of the present invention can be used when ceramic powders of different materials are used to prepare dense ceramic diaphragms with a thickness of 20-250 μm. The diaphragm prepared by using aluminum oxide micron-scale ceramic powder is suitable for the preparation of sensors, and changing the material of the ceramic powder due to different application fields does not affect the process flow of the present invention. The thickness of the membrane powder layer 5 in step 3 is 100-1000 μm, which is determined by the quality of the micron-sized ceramic powder used and also by the thickness of the ceramic membrane to be prepared.
specific Embodiment approach 3
[0009] Specific embodiment three: In specific embodiment one, the buffer material described in step two buffer layer forming is mainly composed of ceramic powder and activated carbon powder with a nano-scale particle size for preparing ceramic diaphragms, and the nano-scale particle size The particle diameter of the ceramic powder is 5-500nm, and the mass of the activated carbon powder accounts for 1-20% of the total mass of the buffer material. On the one hand, the existence of the buffer layer material can make the entire pressed object have sufficient thickness (above 0.5mm), preventing the core 3 and the briquetting block 2 of the mold from being directly pressed together to cause damage; on the other hand, the buffer layer can also make the The pressure of the diaphragm layer and the green body density distribution are more uniform.
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