Contact component and its manufacture and probe contact assembly using the contact component

A technology for contacting components and contacting components, which is applied to contact components, measuring leads/probes, components of connecting devices, etc., can solve problems such as inconsistent quality, and achieve the effects of low cost, long life and low cost
CN1345087AInactive Publication Date: 2002-04-17株式会社鼎新
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
株式会社鼎新
Publication Date
2002-04-17
Estimated Expiration
Not applicable · inactive patent

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Abstract

A method for producing a contact structure for establishing electrical connection with contact targets. The contact structure is formed of a contact substrate and a plurality of contactors. The contactor has a tip portion at one end of the contactor to contact with the contact target, a base portion at another end of the contactor which is inserted in a through hole provided on the contact substrate in such a way that an end of the contactor functions as a contact pad for electrical connection at a surface of the contact substrate, and a spring portion provided between the tip portion and the base portion which produces a contact force when the contactor is pressed against the contact target.
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Description

field of invention

[0001] The invention relates to a contact member, a production method thereof, and a probe contact assembly using the contact member. More specifically, the present invention relates to a contact member having a large number of contacts in a vertical direction. The invention further relates to a method for producing a large number of contacts on a semiconductor wafer in a horizontal orientation, and removing from the wafer the contacts mounted on a substrate in a vertical orientation to form a contact structure, for example, Contact probe assemblies, probe cards, IC chips, or other contact mechanisms. background of the invention

[0002] When testing high-density and high-speed electronic devices such as LSI (Large Scale Integration) and VLSI (Very Large Scale Integration), high-performance contact members such as probe cards having a large number of contacts must be used. In other applications, the contact members may be used in IC p...

Claims

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