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Packing of memory device using electron emitting

A technology of emitters and electron beams, applied in the direction of electric solid-state devices, static memory, digital memory information, etc., can solve problems such as impact, electron beam dispersion, and difficulties

Inactive Publication Date: 2002-10-09
HEWLETT PACKARD CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The electron beam from the emitter is too diffuse to be used without modification to impact the ARS memory area, and reading and writing with the electron beam at the scale of the ARS is becoming an increasingly delicate operation , and are more likely to be affected by stray electrons, atoms or molecules
It is difficult to establish and maintain a vacuum in the storage medium area

Method used

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  • Packing of memory device using electron emitting
  • Packing of memory device using electron emitting
  • Packing of memory device using electron emitting

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Embodiment Construction

[0022] refer to figure 1 , where an atomic resolution memory component of a preferred embodiment of the present invention is shown. Atomic Resolution Storage, or ARS, as used herein, refers to storage and retrieval of information where the storage medium supports greater than 100 gigabits per square inch and the electron beam is focused by electron optics. It is preferred, but not necessary, to use sophisticated MEMS motors to access areas of the storage medium; scanning the electron beam may also accomplish the same.

[0023] figure 1 Shown is an assembled ARS module or module 10 having tabs 12 for connection to external circuitry. The module 10 comprises 3 stacked wafers, a stator wafer N, a rotor wafer 16 and an emitter wafer 18 . The wafers are preferably fabricated by standard semiconductor and MEMS microfabrication processes and have approximately the same X-Y dimensions. The ARS assembly 10 is preferably vacuum-sealed, with the wafers spaced apart and bonded togethe...

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Abstract

An information storage unit (10) operating in a vacuum includes a data storage medium (28) having information storage areas (30a, 30b) for storing and reading information thereon. An array of electron beam emitters (20) is spaced from but in close proximity to the data storage medium (28) for selectively directing a plurality of electron beams (21) towards the data storage medium (28). Focusing optics (25) between the array of electron beam emitters (20) and the data storage medium (28) focus each electron beam (21) onto a portion of the information storage area (30a, 30b) of the data storage medium (28) . The microelectromechanical motor comprises a stator wafer (14) with driving electrodes (42) and a rotor wafer (16) with driven electrodes (40), connected to a data storage medium (28) so that the data storage medium (28) is relative to the electronic The array of beam emitters (20) moves so that each emitter (20) selectively directs the electron beam (21) to a part of the information storage area (30b) to read and write information thereon.

Description

technical field [0001] The present invention belongs to the field of information storage units. More particularly, the present invention relates to providing an information storage unit using an array of electron beam emitters and an information storage medium utilizing microelectromechanical systems for relative movement of the emitters. technical background [0002] Electronic devices, such as PDAs, digital cameras, and cellular phones, are becoming more compact and miniaturized even though they contain more sophisticated data processing and storage circuits. In particular, various digital communications other than text (such as video, audio, and images) have become more common, and they require huge amounts of data to transmit their inherently complex information. These developments have created a huge demand for new storage technologies that can handle more complex data at lower prices and in much more compact packages. [0003] One response to this need has been the d...

Claims

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Application Information

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IPC IPC(8): B81B7/02G11B9/00G11B9/10G11B9/12G11B11/08G11B11/24G11B19/20G11B25/04
CPCB82Y10/00G11B9/10G11B9/1418G11B11/08G11B19/20G11B25/04
Inventor K·J·埃尔德雷奇W·C·米切尔S·L·纳伯惠斯C·C·杨
Owner HEWLETT PACKARD CO
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