Method for mfg. semiconductor/magnet/semicondustor threelayer structure
A three-layer structure, semiconductor technology, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc.
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Embodiment 1
[0023] (1) Using GaAs single crystal as the substrate;
[0024] (2) epitaxy a thin layer of GaMnAs on GaAs by means of ion beam epitaxy;
[0025] (3) Using ion beam epitaxy to epitaxially GaAs on GaMnAs as a capping layer;
[0026] (4) According to the above growth process, a GaMnAs thin film is grown on a gallium arsenide substrate, and the Mn composition is found to be 0.8-7.4% by Auger spectrum analysis.
Embodiment 2
[0028] (1) Using Si single crystal as the substrate;
[0029] (2) Epitaxy a thin layer of MnSi on Si by means of ion beam epitaxy ~1.73 ;
[0030] (3) Using ion beam epitaxy on MnSi ~1.73 The upper epitaxial GaAs is used as the covering layer;
[0031] The intentional effect of the invention compared with the background technology: Compared with other methods for preparing magnetic semiconductor materials, the outstanding advantage of ion beam epitaxy is that it can purify ions to isotopic purity, so that other processes can be prepared under ultra-high vacuum conditions Special materials that are difficult to realize, difficult to purify, difficult to combine, and easy to oxidize.
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